Cylindrical magnetron with self cleaning target

• US 7,014,741 B2
• Filed: 02/21/2003
• Issued: 03/21/2006
• Est. Priority Date: 02/21/2003
• Status: Active Grant

• Current Assignee: Von Ardenne Anlagentechnik GmbH
• Original Assignee: Von Ardenne Anlagentechnik GmbH
• Inventors: Rietzel, James G., Johnson, Kevin D.
• Primary Examiner(s): VERSTEEG, STEVEN H
• Application Number:
  US10/371,174
• Publication Number:
  US 20040163943A1
• Time in Patent Office: 1,124 Days
• Field of Search: 204/298.21, 204/298.22, 204/298.12, 204/192.12
• US Class Current: 204/298.22
• CPC Class Codes: H01J 37/3405 Magnetron sputtering

Abstract

A cylindrical magnetron capable of running at high current and voltage levels with a target tube that is self cleaning not only in the center portion, but also at the ends. Sputtering the ends of the target tube virtually eliminates accumulation of condensate at the ends and any resultant arcing, resulting in a more reliable magnetron requiring less service and a magnetron that produces more consistent coatings.

Claims

1. A magnetron having endblocks, the magnetron comprising:

a cylindrical target tube comprising a material to be sputtered onto a substrate, the target tube consisting of portions of the target tube within the endblocks and an exposed portion without the endblocks, the cylindrical target tube having a closed circle groove near an end of the cylindrical target tube;

support structures located at the ends of the target tube that position the target tube and supply cooling water and power to the target tube, support structures including a support portion that has an outer circumference that is approximately equal to the circumference of the target tube;

a clamp that extends around the outer circumference of the support portion and the end of the cylindrical target tube; and

a magnetic structure within the target tube, the magnetic structure having a magnetic field that extends the length of the exposed portion of the target tube such that the entire exposed portion is sputtered.

2. The magnetron of claim 1 wherein the magnetic field is of sufficient strength along the entire length of the target tube to sputter along the entire length of the target tube.

3. The magnetron of claim 1 wherein the magnetron target tube is self cleaning, thereby minimizing the deleterious effects of electrical arcing.

4. The magnetron of claim 1 wherein the magnetic structure has a higher magnetic field density at the ends of the structure compared to the central portion of the structure, and wherein the target tube comprises an additional amount of material positioned about the ends of the target tube.

5. The magnetron of claim 1 wherein an additional amount of material is added near the ends of the target tube and the additional amount of material comprises the same material as the material to be sputtered onto the substrate.

6. The magnetron of claim 5 wherein the additional amount of material is integrally formed with the target.

7. The magnetron of claim 1 wherein an additional amount of material is added near the ends of the target tube, the additional amount of material has an uncovered cylindrical outer surface and the additional amount of material comprises a different material than the material to be sputtered onto the substrate.

8. The magnetron of claim 7 wherein the different material has a lower sputtering rate than the material to be sputtered and extends the life of the target tube.

9. The magnetron of claim 1 wherein an additional amount of material is added near the ends of the target tube and the additional amount of material is in the form of a collar ring attached to the target tube.

10. A cylindrical magnetron comprising:

a cylindrical target tube comprising a material to be sputtered onto a substrate, the cylindrical target tube having a closed circle groove near an end of the cylindrical target tube;

support structures located at the ends of the target tube that position the target tube and supply cooling water and power to the target tube, a support structure including a spindle portion that has an outer circumference that is approximately equal to the circumference of the target tube;

a clamp that extends around the outer circumference of the spindle portion and the end of the cylindrical target tube; and

a magnetic array within the target tube, the magnetic array positioned within the target tube such that a magnetic field generated by the magnetic array extends into the support structures and the target tube is self cleaning for its entire length except for portions that are within the support structures.

11. The magnetron of claim 10 wherein the magnetic array has a higher magnetic field density at the ends of the array compared to the central portion of the array, and wherein an additional amount of material is positioned about the target tube adjacent the higher magnetic field density.

12. The magnetron of claim 11 wherein the magnetron has an allowable substrate width, and wherein the additional amount of material is positioned such that it will be sputtered outside the allowable width and will not be substantially deposited upon the substrate.

13. The magnetron of claim 11 wherein less than one percent of a primary component of the additional material is deposited upon the substrate.

14. The magnetron of claim 11 wherein the additional material is different than the material to be sputtered.

15. The magnetron of claim 10 wherein condensate at the target tube ends is minimized to a level sufficient to prevent arcing at the target tube ends.

16. A magnetron comprising:

a target tube having a first collar with a first circular groove at a first end and a second collar with a second circular groove at a second end, the first and second collar formed of a first material, the target tube formed of a second material that is different to the first material;

means for supporting the target tube, the means for supporting the target tube including a first support portion that has an outer circumference that is approximately equal to the circumference of the target tube;

means for rotating the target tube, the means for rotating the target tube including a second support portion that has an outer circumference that is approximately equal to the circumference of the target tube;

a first clamp that extends around the outer circumference of the first support portion and the first end of the target tube;

a second clamp that extends around the outer circumference of the second support portion and the second end of the target tube; and

means for sputtering material from the target tube along the entire exposed length of the target tube, the means for sputtering material configured such that the only portions of the target tube that are not sputtered are inside the means for supporting the target tube and inside the means for rotating the target tube.

17. The magnetron of claim 16 further comprising means for extending the usable life of the target tube.

18. A method for preventing arcing in a magnetron, improving the coatings deposited upon a substrate, and increasing the efficiency of the magnetron, the method comprising:

providing a cylindrical target tube, the target tube having a length between a first end and a second end, the target tube having a first collar with a first circular groove at a first end and a second collar with a second circular groove at a second end, the first and second collars formed of a collar material that is not that target tube material;

providing a magnet array having a magnetic field;

providing a first endblock enclosing the first end and a second endblock enclosing the second end such that an exposed length extending from the first endblock to the second endblock remains exposed the first endblock including a first endblock portion that has an outer circumference that is approximately equal to the circumference of the target tube, the second endblock including a second endblock portion that has an outer circumference that is approximately equal to the circumference of the target tube;

providing a first clamp that extends around the outer circumference of the first endblock portion and the first end of the target tube;

providing a second clamp that extends around the outer circumference of the second endblock portion and the second end of the target tube; and

positioning the magnet array within the target tube such that the magnetic field extends along the length of the target tube and extends into the first and second endblocks and such that the entire exposed length of the target tube is sputtered during sputtering operations.

19. The method of claim 18 wherein the entire target tube is self cleaning.

20. The method of claim 18 wherein arcing from the target is eliminated.

21. The method of claim 18 further comprising providing additional material at high sputtering rate areas of the target tube.

22. A cylindrical target tube comprising a first material to be sputtered onto a substrate, a collar of a second material at an end, the collar having a circular groove and a magnetic array within the target tube, the target tube clamped at the ends to support structures having outer circumferences that are approximately equal to the circumference of the target tube, the target tube clamped to the support structures by clamps that extend around the outer circumferences of the support structures and the ends of the target tube, the magnetic array positioned within the target tube such that the entire unclamped portion of target tube is sputtered, the clamped target tube ends within endblock housings such that the unclamped portion extends between endblock housings.

23. A system for attaching a cylindrical sputtering target tube to an endblock, comprising:

a cylindrical target tube having a closed circle groove near an end of the cylindrical target tube;

an endblock portion that has an outer circumference that is approximately equal to the circumference of the target tube; and

a clamp that extends around the outer circumference of the endblock portion and the end of the cylindrical target tube.

24. The system of claim 23 wherein the target tube has a collar portion near the end of the cylindrical target tube and the groove is formed in the collar portion, the target tube comprising a target material and the collar portion formed of a collar material that is not the target material.

25. The system of claim 23 wherein the clamp extends about both the endblock portion and the end of the target in a radial direction and also extends into the groove to capture the endblock portion and the end of the cylindrical target tube in an axial direction.

26. A system for attaching a cylindrical sputtering target tube to an endblock, comprising:

a cylindrical target tube having a circular groove near an end of the cylindrical target tube, the cylindrical target tube having a collar portion near the end of the cylindrical target tube and the groove formed in the collar portion, the target tube comprising a target material and the collar portion formed of a collar material that is not the target material;

an endblock portion that has an outer circumference that is approximately equal to the circumference of the target tube; and

a clamp that extends around the outer circumference of the endblock and the end of the cylindrical target tube.