Method of manufacturing an enhanced thermal dissipation integrated circuit package

• US 7,015,072 B2
• Filed: 03/18/2004
• Issued: 03/21/2006
• Est. Priority Date: 07/11/2001
• Status: Expired due to Fees

• Current Assignee: Utac Headquarters Pte. Ltd (UTAC Holdings Ltd.)
• Original Assignee: ASAT Company Limited
• Inventors: Fan, Chun Ho, Sheppard, Robert P., McLellen, Neil Robert, Ng, Hau Wang, Combs, Edward G., Pun, Tai Wai
• Primary Examiner(s): Chambliss, Alonzo
• Application Number:
  US10/803,782
• Publication Number:
  US 20050003585A1
• Time in Patent Office: 733 Days
• Field of Search: 438/106, 438/121, 438/122, 257/706, 257/707, 257/712, 257/713, 257/717, 257/720, 257/787, 257/796, 361/679, 361/688, 361/689, 361/702, 361/704, 361707-711
• US Class Current: 438/122
• CPC Class Codes: H01L 21/4871 Bases, plates or heatsinks
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/16315 : Shape
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

In one aspect, the present invention relates to a method of manufacturing an integrated circuit package, the method including installing a carrier onto a substrate, attaching a semiconductor die to the substrate, and aligning an assembly over the semiconductor die, wherein the assembly includes a heat sink and a thermally conductive element. This aspect further includes resting the assembly on the carrier such that the thermally conductive element does not directly contact the semiconductor die, and encapsulating the thermally conductive element and the heat sink such that a portion of the heat sink is exposed to the surroundings of the package.

Claims

1. A method of manufacturing an integrated circuit package, comprising:

installing a carrier onto an upper surface of a substrate, wherein said carrier defines a cavity;

attaching a semiconductor die to said upper surface of said substrate within said cavity of said carrier;

aligning an assembly over said semiconductor die, wherein said assembly comprises a heat sink and a thermally conductive element;

resting said assembly on said carrier such that said thermally conductive element does not directly contact said semiconductor die;

encapsulating said cavity to form a prepackage such that a portion of said heat sink is exposed to the surroundings of said package; and

singulating said prepackage to form said package, wherein a top portion and a side portion of said heat sink are exposed to the surroundings of said package.

2. The method of claim 1, wherein said assembly is rested on said carrier such that said thermally conductive element and said semiconductor die are separated by a distance of about five (5) mils or less.

3. The method of claim 1, wherein said attaching said semiconductor die to said upper surface of said substrate is by a direct chip attachment.

4. The method of claim 1, wherein said thermally conductive element is substantially shaped as a right rectangular solid.

5. The method of claim 1, wherein said heat sink comprises a top portion, a side portion, and an extending finger when viewed from a top of said package, said extending finger comprising said side portion.

6. The method of claim 5, wherein said extending finger extends from a corner of said heat sink.

7. The method of claim 1, wherein said encapsulating comprises encapsulating said thermally conductive element and said heat sink such that said top portion and said side portion of said heat sink are exposed to the surroundings of said package.

8. The method of claim 1, wherein said thermally conductive element is made of a material from the group consisting of alumina, aluminum nitride, beryllium oxide, ceramic material, copper, diamond compound, and metal.

9. The method of claim 1, wherein said integrated circuit package is a ball grid array integrated circuit package.

10. A method of manufacturing an integrated circuit package, comprising:

installing a carrier onto a substrate;

attaching a semiconductor die to said substrate;

aligning an assembly over said semiconductor die, wherein said assembly comprises a heat sink and a thermally conductive element;

resting said assembly on said carrier such that said thermally conductive element does not directly contact said semiconductor die;

encapsulating said thermally conductive element and said heat sink such that a portion of said heat sink is exposed to the surroundings of said package; and

singulating, wherein a top portion and a side portion of said heat sink are exposed to the surroundings of said package.

11. The method of claim 10, wherein said thermally conductive element is substantially shaped as a right rectangular solid.

12. The method of claim 10, wherein said heat sink comprises a top portion, a side portion, and an extending finger when viewed from a top of said package, said extending finger comprising said side portion.

13. The method of claim 12, wherein said extending finger extends from a corner of said heat sink.

14. The method of claim 10, wherein said encapsulating comprises encapsulating said thermally conductive element and said heat sink such that said top portion and said side portion of said heat sink are exposed to the surroundings of said package.

15. The method of claim 10, wherein said thermally conductive element is made of a material from the group consisting of alumina, aluminum nitride, beryllium oxide, ceramic material, copper, diamond compound, and metal.

16. The method of claim 10, wherein said integrated circuit package is a ball grid array integrated circuit package.

17. The method of claim 10, wherein said assembly is rested on said carrier such that said thermally conductive element and said semiconductor die are separated by a distance of about five (5) mils or less.

18. The method of claim 10, wherein said attaching said semiconductor die to said substrate is by a direct chip attachment.