Method of fabricating one-time programmable read only memory

• US 7,015,100 B1
• Filed: 12/23/2004
• Issued: 03/21/2006
• Est. Priority Date: 12/23/2004
• Status: Active Grant

• Current Assignee: United Microelectronics Corporation
• Original Assignee: United Microelectronics Corporation
• Inventors: Lee, Wen-Fang, Lin, Asam, Hsu, Dave
• Primary Examiner(s): Lee, Hsien-Ming
• Application Number:
  US11/022,204
• Time in Patent Office: 453 Days
• Field of Search: 438/257, 438/258, 438/261, 438/266
• US Class Current: 438/257
• CPC Class Codes: H01L 27/105 including field-effect components
• CPC Class Codes: H10B 20/65 of memory structures of the ROM only type

Abstract

A method of fabricating a one-time programmable read only memory of the present invention is provided. First, a substrate having a memory cell area and a peripheral circuit area is provided. The memory cell area includes at least a one-time programmable read only memory cell, while the peripheral circuit area includes at least a logic device. Thereafter, a silicon oxide layer is formed over the substrate to cover the one-time programmable read only memory cell, the logic device and the exposed surface of the substrate. Next, a silicon nitride layer is formed on the silicon oxide layer. Then, the silicon nitride layer and the silicon oxide layer in the peripheral circuit area are removed, and the retained silicon nitride layer and silicon oxide layer in the memory cell area are as a salicide blocking layer (SAB). Thereafter, a salicide process is performed.

Claims

1. A method of fabricating a one-time programmable read only memory, comprising:

providing a substrate comprising a memory cell area and a peripheral circuit area, wherein the memory cell area includes at least a one-time programmable read only memory cell, while the peripheral circuit area includes at least a logic device;

forming a silicon oxide layer over the substrate to cover the one-time programmable read only memory cell, the logic device and the exposed surface of the substrate;

forming a silicon nitride layer on the silicon oxide layer;

removing the silicon nitride layer and the silicon oxide layer in the peripheral circuit area, wherein the retained silicon nitride layer and silicon oxide layer in the memory cell area are as a salicide blocking layer (SAB); and

performing a salicide process.

2. The method of claim 1, wherein forming the silicon nitride layer comprises:

performing a low pressure chemical vapor deposition (LPCVD).

3. The method of claim 1, wherein the thickness of the silicon nitride layer is 160 Å

.

4. The method of claim 1, wherein forming the silicon oxide layer comprises:

performing a low pressure chemical vapor deposition (LPCVD).

5. The method of claim 1, wherein the thickness of the silicon oxide layer is 200 Å

.

6. The method of claim 1, wherein the method for forming the one-time programmable read only memory cell and the logic device comprises:

forming a tunnel layer and an inter-gate dielectric layer on the surface of the substrate in the memory cell area respectively, and forming a gate dielectric layer on the surface of the substrate in the peripheral circuit area;

forming a doped region used as a control gate in the substrate under the inter-gate dielectric layer;

forming a floating gate on the inter-gate dielectric layer and the tunnel layer of the memory cell area, and forming a gate on the gate dielectric layer of the peripheral circuit area; and

forming a first source region and a first drain region in the substrate of two sides of the floating gate under the tunnel layer of the memory cell area, and forming a second source region and a second drain region in the substrate of two sides of the gate of the peripheral circuit area.

7. The method of claim 1, wherein the salicide process comprises:

forming a metal layer over the substrate to cover the salicide blocking layer, the logic device in peripheral circuit area, and the exposed surface of the substrate;

performing a salicide step, wherein a portion of the metal layer is formed a salicide layer; and

removing the retained metal layer.