Radiating structural body of electronic part and radiating sheet used for the radiating structural body
First Claim
1. A heat dissipating structure for a heat generating electronic component, comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion, stacked on said metal sheet, between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member, wherein said heat conductive member having adhesion is formed of a heat conductive composition comprising at least one resin component selected from the group consisting of pressure sensitive adhesive siloxane polymers, a heat conductive filler, and a phase transition material or thermosoftening material selected from the group consisting of silicone resins, the composition having a plasticity at 25°
- C. in the range of 100 to 1,000, as measured by JIS K-6249, and being able to phase change or soften by the heat from the electronic component during operation.
1 Assignment
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Accused Products
Abstract
A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.
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Citations
13 Claims
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1. A heat dissipating structure for a heat generating electronic component, comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion, stacked on said metal sheet, between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member, wherein said heat conductive member having adhesion is formed of a heat conductive composition comprising at least one resin component selected from the group consisting of pressure sensitive adhesive siloxane polymers, a heat conductive filler, and a phase transition material or thermosoftening material selected from the group consisting of silicone resins, the composition having a plasticity at 25°
- C. in the range of 100 to 1,000, as measured by JIS K-6249, and being able to phase change or soften by the heat from the electronic component during operation.
- View Dependent Claims (2, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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3. A heat dissipating sheet adapted to be interposed between a heat generating electronic component and a heat dissipating member, comprising a metal sheet adapted to be disposed on the side of the heat generating electronic component and a heat conductive member having adhesion, stacked on the metal sheet and adapted to be disposed on the side of the heat dissipating member, wherein the heat conductive member having adhesion is formed of a heat conductive composition comprising at least one resin component selected from the group consisting of pressure sensitive adhesive siloxane polymers, a heat conductive filler, and a phase transition material or thermosoftening material selected from the group consisting of silicone resins, the composition having a plasticity at 25°
- C. in the range of 100 to 1,000, as measured by JIS K-6249, and being able to phase change or soften by the heat from the electronic component during operation.
Specification