Surface acoustic wave filter packaging
First Claim
1. A wireless transceiver that receives a signal, the wireless transceiver comprising:
- a surface acoustic wave filter die that receives a signal and that filters the signal; and
the surface acoustic wave filter die is mounted in a flip chip configuration on an integrated substrate, and a passivation layer is deposited on an active region of the surface acoustic wave filter die prior to the surface acoustic wave filter die being mounted on the integrated substrate.
0 Assignments
0 Petitions
Accused Products
Abstract
A system that provides packaging for a surface acoustic wave filter in such a way that the surface acoustic wave filter is capable of integration with a number of additional electronic devices on an integrated substrate. The surface acoustic wave filter is mounted in a “flip chip” configuration that enables the surface of the surface acoustic wave filter to be protected from a molding compound during and after the encapsulation of the surface acoustic wave filter and other circuitry contained on the integrated substrate. The manner in which the surface acoustic wave filter is packaged provides a great reduction in cost and occupied real estate on the integrated substrate, in that, the surface acoustic wave filter is mounted in such as way as not to require conventionally used ceramic packaging that encases the surface acoustic wave filter. An air gap is preserved between the surface acoustic wave filter side of the surface acoustic wave filter and the integrated substrate on which it is mounted. This air gap ensures proper operation of the surface acoustic wave filter. In addition, a passivation layer is deposited on the surface acoustic wave filter side of the surface acoustic wave filter before it is mounted in the “flip chip” configuration, thereby provided a degree of protection of the surface acoustic wave filter side of the surface acoustic wave filter.
-
Citations
18 Claims
-
1. A wireless transceiver that receives a signal, the wireless transceiver comprising:
-
a surface acoustic wave filter die that receives a signal and that filters the signal; and the surface acoustic wave filter die is mounted in a flip chip configuration on an integrated substrate, and a passivation layer is deposited on an active region of the surface acoustic wave filter die prior to the surface acoustic wave filter die being mounted on the integrated substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A multi-chip module comprising:
-
a surface acoustic wave filter die; a passivation layer deposited on the surface acoustic wave filter die prior to the surface acoustic wave filter die being mounted on an integrated substrate; a surface mounted circuitry, the surface mounted circuitry comprises a switching circuitry; a chip on board circuitry, the chip on-board circuitry comprises a low noise amplifier die and a mixer die; and wherein each of the surface mounted circuitry and the chip on-board circuitry is mounted on the integrated substrate. - View Dependent Claims (11, 12, 13)
-
-
14. A method to package a surface acoustic wave (SAW) filter die, the method comprising:
-
passivating an active region of the surface acoustic wave filter die; mounting the surface acoustic wave filter die on a plurality of contact pads on a substrate using a plurality of solder balls; and encapsulating the surface acoustic wave filter die on the substrate. - View Dependent Claims (15, 16, 17, 18)
-
Specification