Loadlock with integrated pre-clean chamber

• US 7,018,504 B1
• Filed: 09/11/2000
• Issued: 03/28/2006
• Est. Priority Date: 09/11/2000
• Status: Active Grant

• Current Assignee: ASM IP Holding B.V. (ASM International NV)
• Original Assignee: ASM America Incorporated (ASM International NV)
• Inventors: Raaijmakers, Ivo, Aggarwal, Ravinder, Kusbel, James
• Primary Examiner(s): Zervigon, Rudy
• Application Number:
  US09/658,784
• Time in Patent Office: 2,024 Days
• Field of Search: 118/719, 118/728, 118/730, 156/345, 414/217, 414/214, 414/217.1, 414/805, 29/250.1, 427/575, 427/237, 438/694, 117/708, 117/90, 141/93, 204/298.06
• US Class Current: 156/345.31
• CPC Class Codes: H01L 21/67167 surrounding a central transfer chamber
• CPC Class Codes: H01L 21/67201 characterized by the construction of the load-lock chamber
• CPC Class Codes: H01L 21/67751 vertical transfer of a single workpiece
• CPC Class Codes: H01L 21/67757 vertical transfer of a batch of workpieces

Abstract

A wafer carrier adapted to hold a plurality of wafers and is positioned on an elevator plate in a load lock. The elevator plate is adapted to move between a first position with the carrier in a first chamber of the load lock and a second position with the carrier in the auxiliary chamber. In the second position, the elevator plate substantially seals the auxiliary chamber from the first chamber. In use, a first wafer is placed onto the wafer carrier. The wafer carrier can moved into the auxiliary chamber before or after the first wafer is placed onto the wafer carrier. The first wafer is auxiliary processed in the auxiliary chamber. A second wafer is placed onto the wafer carrier. Preferably after the second wafer is placed onto the wafer carrier, the first wafer is removed from the load lock. A third wafer is preferably then placed onto the wafer carrier so that the second wafer can cool. The second wafer is then removed from the load lock. The cycle is repeated.

Claims

1. A system for processing substrates, comprising

a load lock chamber including a lower portion having a first inner width and an upper portion having a narrower second inner width, the chamber including a first port and a second port, each of the ports sized to pass substrates therethrough, the load lock chamber further comprising a moveable platform configured to support at least one substrate thereon and sized to have a width less than the first inner width and greater than the second inner width to enable selectively sealing the upper portion with the at least one substrate supported thereon;

a substrate handling chamber selectively communicating with the load lock chamber through the first port; and

at least one process chamber selectively communicating with the substrate handling chamber, wherein the first port is located in the upper portion.

3. The system of claim 1, further comprising a substrate carrier that is attached to said moveable platform.

4. The system of claim 1, further comprising a substrate carrier on said moveable platform, the substrate carrier being adapted to receive at least a pair of substrates.

5. The system of claim 4, wherein said substrate carrier is located on top of said moveable platform and said moveable platform is configured to move vertically in said load lock chamber.

6. The system of claim 1, wherein the upper portion includes treatment gas injectors that communicate with a source of HF vapor.

7. The system of claim 1, wherein the upper portion includes treatment gas injectors that communicate with an oxidant source.

8. The system of claim 1, wherein said load lock chamber further includes heating elements.

9. The system of claim 8, wherein said heating elements are located within said upper portion.

2. A system for processing substrates, comprising

a load lock chamber including a lower portion having a first inner width and an upper portion attached to the lower portion and having a narrower second inner width, the chamber including a first port and a second port, each of the ports sized to pass substrates therethrough, the load lock chamber further comprising a moveable platform configured to support at least one substrate thereon and sized to have a width less than the first inner width and greater than the second inner width to enable selectively sealing the upper portion with the at least one substrate supported thereon;

an auxiliary processing system selectively communicating with an opening in the upper portion;

a substrate handling chamber selectively communicating with the load lock chamber through the first port; and

at least one process chamber selectively communicating with the substrate handling chamber, wherein said first port opens into said upper portion and said second port opens into said lower portion.

10. The system of claim 2, further comprising a substrate carrier that is attached to said moveable platform.

11. The system of claim 2, further comprising a substrate carrier on said moveable platform, the substrate carrier being adapted to receive at least a pair of substrates.

12. The system of claim 11, wherein said substrate carrier is located on top of said moveable platform and said moveable platform is configured to move vertically in said load lock chamber.

13. The system of claim 2, wherein the upper portion includes treatment gas injectors that communicate with a source of HF vapor.

14. The system of claim 2, wherein the upper portion includes treatment gas injectors that communicate with an oxidant source.

15. The system of claim 2, wherein said load lock chamber further includes heating elements.

16. The system of claim 15, wherein said heating elements are located within said upper portion.