Method for fabricating an isolated microelectromechanical system (MEMS) device using an internal void
First Claim
1. A method for fabricating a MEMS device onto a substrate having a movable MEMS element portion free from the substrate and disposed adjacent a stationary MEMS element that is in mechanical communication with the substrate, the method comprising the steps of:
- (a) providing a wafer having opposed first and second surfaces;
(b) depositing a spacer material onto the first surface of the wafer;
(c) forming a recess within a middle portion of the spacer material;
(d) depositing an insulating layer onto the wafer in the recess;
(e) attaching the spacer material to the substrate to form a composite structure having a void disposed therein; and
(f) etching into the wafer towards the substrate to remove a portion of the wafer and release the movable MEMS element.
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Abstract
A method for fabricating an electrically isolated MEMS device having an outer stationary MEMS element and an inner movable MEMS element is provided that does not use a sacrificial layer. Rather, a pair of spacers are defined on the outer portions of the upper surface of a conductive wafer, and an insulating material is deposited thereon. The spacers are attached to a substrate to define an internal void therein. The wafer is then patterned to form the outer MEMS element as well as a conductive member for the inner MEMS element, separated from the outer MEMS element by a gap. A portion of the insulating layer that is disposed in the gap is then removed, thereby releasing the inner MEMS element from the stationary MEMS element.
72 Citations
18 Claims
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1. A method for fabricating a MEMS device onto a substrate having a movable MEMS element portion free from the substrate and disposed adjacent a stationary MEMS element that is in mechanical communication with the substrate, the method comprising the steps of:
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(a) providing a wafer having opposed first and second surfaces; (b) depositing a spacer material onto the first surface of the wafer; (c) forming a recess within a middle portion of the spacer material; (d) depositing an insulating layer onto the wafer in the recess; (e) attaching the spacer material to the substrate to form a composite structure having a void disposed therein; and (f) etching into the wafer towards the substrate to remove a portion of the wafer and release the movable MEMS element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification