×

Electronic device manufacture

  • US 7,018,678 B2
  • Filed: 06/03/2003
  • Issued: 03/28/2006
  • Est. Priority Date: 06/03/2002
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method for depositing an organic polysilica cap layer on a dielectric material comprising the steps of:

  • a) disposing a cap layer composition on a dielectric material, the cap layer composition comprising one or more B-staged organic polysilica resins and one or more coating enhancers; and

    b) at least partially curing the B-staged organic polysilica resin to form a cap layer;

    wherein the coating enhancer is present in an amount sufficient to provide a pinhole-free cap layer and wherein the cap layer has an etch selectivity of 3;

    1 greater as compared to the dielectric material.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×