Storage apparatus, card type storage apparatus, and electronic apparatus

• US 7,019,392 B2
• Filed: 08/14/2003
• Issued: 03/28/2006
• Est. Priority Date: 03/26/1998
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Iwasaki, Hiroshi
• Primary Examiner(s): Williams, Alexander Oscar
• Application Number:
  US10/640,038
• Publication Number:
  US 20040047210A1
• Time in Patent Office: 957 Days
• Field of Search: 257/679, 257/774, 257/680, 257/727, 235/380, 235/487, 235/486, 235/492, 361/395, 361/401, 361/752, 361/212, 361/220, 361/390, 361/391, 361/399, 395/882, 395/822, 395/894, 395/188.01
• US Class Current: 257/679
• CPC Class Codes: G06K 19/07739 comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semiconductor device 14 disposed on the second surface of the wiring substrate 11 and having a connection terminal 14a connected to the flat type external connection terminal 12a, a molding resin 15 for coating the semiconductor device 14 on the second surface of the wiring substrate 11, a card type supporting frame 10a having a concave portion or a hole portion fitting the wiring substrate 11, the semiconductor device 14, and the molding resin 15 in such a manner that the flat type external connection terminal 12a is exposed to the first surface of the wiring substrate 11, and adhesive resin a adhering integrally the flat type external connection terminal 12a, the wiring substrate 11, the semiconductor device 14, the molding resin 15, and the card type supporting frame 10a. In addition, the storage apparatus 10 can be combined with a card type supporting means 21 that supports detachably with the flat type external connection terminal 12a exposed to one of the surfaces so as to be used as a card type storage apparatus 20 having bigger size.

Claims

1. A storage device, comprising:

a storage apparatus which has a wiring substrate having a first surface and a second surface, a flat type external connection terminal disposed on the first surface of said wiring substrate, a semiconductor device disposed on the second surface of said wiring substrate and having a connection terminal electrically connected to said flat type external connection terminal, a resin layer for covering said semiconductor device and the second surface of said wiring substrate so as to form a flat molding body on the second surface of said wiring substrate in such a manner that said flat type external connection terminal is exposed, and a marker formed on a surface of the molding body being opposite side of said flat type external connection terminal for representing an inserting direction of the storage apparatus; and

a supporting frame having a concave portion, the concave portion detachably fitting said storage apparatus.

2. The storage device as set forth in claim 1,

wherein said wiring substrate has a via-hole connecting said flat type external connection terminal on the first surface with an internal connection terminal on the second surface, the internal connection terminal being connected to the connection terminal of said semiconductor device.

3. The storage device as set forth in claim 2,

wherein the connection terminal of said semiconductor device and the internal connection terminal of said wiring substrate are connected each other with a bonding wire.

4. The storage device as set forth in claim 1,

wherein said marker represents the inserting direction being parallel with a long side of the storage apparatus.

5. The storage device as set forth in claim 1,

wherein the concave portion of said supporting frame fits said storage apparatus in such a manner that at least a part of said storage apparatus is exposed.

6. The storage device as set forth in claim 1,

wherein the concave portion of said supporting frame fits said wiring substrate and said resin layer in such a manner that said flat type external connection terminal is exposed.

7. The storage device as set forth in claim 1,

wherein a depth of the concave portion of said supporting frame is larger than a thickness of said storage apparatus.

8. The storage device as set forth in claim 1,

wherein said storage device is configured to be installed in a first host apparatus so as to exchange data stored in the semiconductor device with the first host apparatus;

and

wherein said storage apparatus is configured to be installed in a second host apparatus being different from the first host apparatus so as to exchange data stored in the semiconductor device with the second host apparatus.

9. The storage device as set forth in claim 1,

wherein said flat type external connection terminal is composed of a conductor layer, and a plurality of the flat type external connection terminals are disposed on the first surface of said wiring substrate which are electrically separated by a plurality of slits.

10. The storage device as set forth in claim 9,

wherein a pattern of the slit connects any two points of the outer periphery of the conductor layer as a curved line or a bent line.

11. A storage device, comprising:

a storage apparatus which has a wiring substrate having a first surface and a second surface, a flat type external connection terminal disposed on the first surface of said wiring substrate, a semiconductor device disposed on the second surface of said wiring substrate and having a connection terminal electrically connected to said flat type external connection terminal, a resin body covering said semiconductor device and the second surface of said wiring substrate so that the resin body has flat surface on the second surface of said wiring substrate in such a manner that said flat type external connection terminal is exposed, and a marker formed on the flat surface of the resin body being opposite side of said flat type external connection terminal for representing an inserting direction of the storage apparatus; and

a supporting frame having a concave portion, the concave portion detachably fitting said storage apparatus.

12. The storage device as set forth in claim 11,

wherein said wiring substrate has a via-hole connecting said flat type external connection terminal on the first surface with an internal connection terminal on the second surface, the internal connection terminal being connected to the connection terminal of said semiconductor device.

13. The storage device as set forth in claim 12,

wherein the connection terminal of said semiconductor device and the internal connection terminal of said wiring substrate are connected each other with a bonding wire.

14. The storage device as set forth in claim 11,

wherein said marker represents the inserting direction being parallel with a long side of the storage apparatus.

15. The storage device as set forth in claim 11,

wherein the concave portion of said supporting frame fits said storage apparatus in such a manner that at least a part of said storage apparatus is exposed.

16. The storage device as set forth in claim 11,

wherein the concave portion of said supporting frame fits said wiring substrate and said resin body in such a manner that said flat type external connection terminal is exposed.

17. The storage device as set forth in claim 11,

wherein a depth of the concave portion of said supporting frame is larger than a thickness of said storage apparatus.

18. The storage device as set forth in claim 11,

wherein said storage device is configured to be installed in a first host apparatus so as to exchange data stored in the semiconductor device with the first host apparatus;

and

wherein said storage apparatus is configured to be installed in a second host apparatus being different from the first host apparatus so as to exchange data stored in the semiconductor device with the second host apparatus.

19. The storage device as set forth in claim 11,

wherein said flat type external connection terminal is composed of a conductor layer, and a plurality of the flat type external connection terminals are disposed on the first surface of said wiring substrate which are electrically separated by a plurality of slits.

20. The storage device as set forth in claim 19,

wherein a pattern of the slit connects any two points of the outer periphery of the conductor layer as a curved line or a bent line.

21. A storage device, comprising:

a storage apparatus which has a wiring substrate having a first surface and a second surface, the second surface having a first area and a second area, the first area of the second surface being unsymmetrically located with respect to a perimeter of said wiring substrate;

a flat type external connection terminal disposed on the first surface of said wiring substrate;

a semiconductor device disposed on the first area of the second surface of said wiring substrate and having a connection terminal electrically connected to said flat type external connection terminal; and

a molding resin which coats said semiconductor device and the first area of the second surface of said wiring substrate so as to render the second area of the second surface uncovered; and

a supporting frame having a concave portion, the concave portion detachably fitting said storage apparatus.