Lithographic projection mask, device manufacturing method, and device manufactured thereby

• US 7,019,814 B2
• Filed: 12/19/2003
• Issued: 03/28/2006
• Est. Priority Date: 12/19/2002
• Status: Expired due to Fees

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Friz, Alexander, Consolini, Joseph J., Best, Keith Frank
• Primary Examiner(s): Nguyen, Henry Hung
• Application Number:
  US10/738,977
• Publication Number:
  US 20040156027A1
• Time in Patent Office: 830 Days
• Field of Search: 355/53, 355/67, 355/77, 430/5, 430/20, 430/22, 356399-401, 250/548
• US Class Current: 355/53
• CPC Class Codes: G03F 9/7076 Mark details, e.g. phase grating mark, temporary mark
• CPC Class Codes: G03F 9/7084 Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels

Abstract

A method according to one embodiment of the invention may be used in determining relative positions of developed patterns on a substrate (exposed e.g. using the step mode). Such a method uses reference marks which are located within or even superimposed on device patterns. Also disclosed is a mask of a lithographic projection apparatus including reference marks that may be used in such a method.

Claims

1. A device manufacturing method comprising:

projecting a first image onto a first target portion of a radiation-sensitive material that at least partially covers a substrate, the first image including a first device pattern and at least a first reference mark located within the first device pattern;

projecting a second image, including a second device pattern and at least a second reference mark, onto a second target portion of the radiation-sensitive material; and

determining a relative placement of the first image and the second image based on a relative position of the first reference mark and the second reference mark, wherein the first reference mark and the second reference mark are not superposed, and wherein the first image and the second image include two reference marks positioned along a line that bisects the corresponding device pattern.

2. The device manufacturing method according to claim 1, wherein the first device pattern and the second device pattern extend around corresponding reference marks.

3. The device manufacturing method according to claim 1, wherein the first device pattern and the second device pattern include a same device pattern.

4. The device manufacturing method according to claim 1, wherein said projecting includes using a patterning structure to pattern a beam of radiation according to the corresponding device pattern.

5. The device manufacturing method according to claim 1, wherein the first image and the second image include two reference marks positioned along a first line that bisects the corresponding device pattern, and

wherein the first image and the second image include two reference marks positioned along a second line that bisects the corresponding device pattern and wherein the second line has a different direction than the first line.

6. The device manufacturing method according to claim 1, said method further comprising developing the radiation-sensitive material to form a plurality of developed patterns on the substrate that corresponding to respective images.

7. The device manufacturing method according to claim 6, said method further comprising determining that the developed patterns are misaligned, based on the relative placement of the respective images;

and

removing an exposed portion and an unexposed portion of the layer of radiation-sensitive material, based on said determining that the developed patterns are misaligned.

8. The device manufacturing method according to claim 1, said method further comprising determining that the first image and the second image are misaligned, based on the relative placement;

and

removing an exposed portion and an unexposed portion of the layer of radiation-sensitive material, based on said determining that the first image and the second image are misaligned.

9. The device manufacturing method according to claim 1, further comprising projecting a third image onto a third target portion of the radiation-sensitive material, said projecting the third image onto the third target portion being based on a result of said determining the relative placement of the first image and the second image.

10. A device manufacturing method comprising:

projecting a first image onto a first target portion of a radiation-sensitive material that at least partially covers a substrate, the first image including a first device pattern and at least a first reference mark located within the first device pattern;

projecting a second image, including a second device pattern and at least a second reference mark, onto a second target portion of the radiation-sensitive material; and

determining a relative placement of the first image and the second image based on a relative position of the first reference mark and the second reference mark, wherein the first reference mark and the second reference mark are not superposed

wherein said projecting the second image onto the second target portion of the radiation-sensitive material includes projecting the second image onto a plurality of target portions of the radiation-sensitive material, each of the plurality of target portions being adjacent to the first target portion,

wherein the first target portion includes a plurality of regions, each of the plurality of regions corresponding to one of the plurality of adjacent target portions and being adjacent to the corresponding target portion, and

wherein each of the plurality of regions includes at least the first reference mark.

11. The device manufacturing method according to claim 10, wherein at least one of the plurality of adjacent target portions at least partially overlaps the corresponding region.

12. A data storage medium including instructions describing a device manufacturing method, said method comprising:

projecting a first image onto a first target portion of a radiation-sensitive material that at least partially covers a substrate, the first image including a first device pattern and at least a first reference mark located within the first device pattern;

projecting a second image, including a second device pattern and at least a second reference mark, onto a second target portion of the radiation-sensitive material; and

determining a relative placement of the first image and the second image based on a relative position of the first reference mark and the second reference mark,

wherein the first reference mark and the second reference mark are not superposed,

wherein said projecting the second image onto the second target portion of the radiation-sensitive material includes projecting the second image onto a plurality of target portions of the radiation-sensitive material, each of the plurality of target portions being adjacent to the first target portion,

wherein the first target portion includes a plurality of regions, each of the plurality of regions corresponding to one of the plurality of adjacent target portions and being adjacent to adjacent to the corresponding target portion, and

wherein each of the plurality of regions includes at least the first reference mark.

13. The data storage medium according to claim 12, wherein said projecting includes using a patterning structure to pattern a beam of radiation according to the corresponding device pattern.

14. The data storage medium according to claim 12, said method further comprising developing the radiation-sensitive material to form a plurality of developed patterns on the substrate that correspond to respective images.

15. The data storage medium according to claim 14, said method further comprising determining that the developed patterns are misaligned, based on the relative placement of the respective images;

and

removing an exposed portion and an unexposed portion of the layer of radiation-sensitive material, based on said determining that the developed patterns are misaligned.

16. The data storage medium according to claim 12, said method further comprising determining that the first image and the second image are misaligned, based on the relative placement;

and

removing an exposed portion and an unexposed portion of the layer of radiation-sensitive material, based on said determining that the first image and the second image are misaligned.

17. The data storage medium according to claim 12, further comprising projecting a third image onto a third target portion of the radiation-sensitive material, said projecting the third image onto the third target portion being based on a result of said determining a relative placement of the first image and the second image.

18. The data storage medium according to claim 12, wherein at least one of the plurality of adjacent target portions at least partially overlaps the corresponding region.

19. A device manufacturing method comprising:

projecting a first image onto a first target portion of a radiation-sensitive material that at least partially covers a substrate, the first image including at least a first reference mark;

projecting a second image onto a second target portion of the radiation-sensitive material, wherein the second image includes at least a second reference mark; and

determining a relative placement of the first image and the second image based on a relative position of the first reference mark in the first target portion and the second reference mark in the second target portion,

wherein the two reference marks do not overlap one another,

wherein said projecting the second image onto the second target portion of the radiation-sensitive material includes projecting the second image onto a plurality of target portions of the radiation-sensitive material, each of the plurality of target portions being adjacent to the first target portion,

wherein the first target portion includes a plurality of regions, each of the plurality of regions corresponding to one of the plurality of adjacent target portions and being adjacent to the corresponding target portion, and

wherein each of the plurality of regions includes at least the first reference mark.

20. The device manufacturing method according to claim 19, wherein said projecting includes using a patterning structure to pattern a beam of radiation according to the corresponding device pattern.

21. The device manufacturing method according to claim 19, said method further comprising developing the radiation-sensitive material to form a plurality of developed patterns on the substrate that correspond to respective images.

22. The device manufacturing method according to claim 21, said method further comprising determining that the developed patterns are misaligned, based on the relative placement of the respective images;

and

removing an exposed portion and an unexposed portion of the layer of radiation-sensitive material, based on said determining that the developed patterns are misaligned.

23. The device manufacturing method according to claim 19, said method further comprising determining that the first image and the second image are misaligned, based on the relative placement;

and

removing an exposed portion and an unexposed portion of the layer of radiation-sensitive material, based on said determining that the first image and the second image are misaligned.

24. The device manufacturing method according to claim 19, further comprising projecting a third image onto a third target portion of the radiation-sensitive material, said projecting the third image onto the third target portion being based on a result of said determining the relative placement of the first image and the second image.

25. The device manufacturing method according to claim 19, wherein at least one of the plurality of adjacent target portions at least partially overlaps the corresponding region.