Method and apparatus for producing a packaged integrated circuit

• US 7,020,858 B1
• Filed: 09/10/2002
• Issued: 03/28/2006
• Est. Priority Date: 09/10/2002
• Status: Active Grant

• Current Assignee: Xilinx, Inc. (Advanced Micro Devices, Inc.)
• Original Assignee: Xilinx, Inc. (Advanced Micro Devices, Inc.)
• Inventors: Wu, Paul Ying-Fung
• Primary Examiner(s): Whitmore, Stacy A.
• Application Number:
  US10/241,428
• Time in Patent Office: 1,295 Days
• Field of Search: 716/5, 716/1
• US Class Current: 716/112
• CPC Class Codes: G06F 30/39 Circuit design at the physical level physical level design for reconfigurable circuits G06F30/347
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA

Abstract

A method of producing a wirebond ball grid array package is described. The method comprises the steps of importing a master pinlist to a computer program, importing a bonding diagram to the computer program, and verifying, by the computer program, substrate artwork against the master pinlist and the bonding diagram. A method of producing a wirebond ball grid array package according to an alternative embodiment comprises the steps of importing a master pinlist to a computer program, importing substrate artwork to the computer program, and verifying, by the computer program, a bonding diagram against the master pinlist and the substrate artwork. Finally, a system for verifying substrate artwork comprises means for importing a master pinlist to a computer program, means for importing a bonding diagram to the computer program, and means for verifying, by the computer program, the substrate artwork against the master pinlist and the bonding diagram.

Claims

1. A method of producing a wirebond ball grid array, the method comprising the steps of:

importing a master pinlist to a computer program;

importing a bonding diagram to the computer program; and

verifying, by the computer program, substrate artwork against the master pinlist and the bonding diagram;

the substrate artwork describing connections between contacts of a substrate of the wirebond ball grid array.

2. The method of claim 1 further comprising a step of identifying errors in the master pinlist.

3. The method of claim 2 further comprising a step of generating a report listing the errors in the master pinlist.

4. The method of claim 1 further comprising a step of comparing a bonding diagram to the master pinlist to identify mismatches between the bonding diagram and the master pinlist.

5. The method of claim 4 further comprising a step of generating a report listing the mismatches between the bonding diagram and the master pinlist.

6. The method of claim 1 further comprising a step of developing an extended pinlist.

7. The method of claim 6 further comprising a step of generating a report listing errors between the substrate artwork and the extended pinlist.

8. A method of producing a wirebond ball grid array, the method comprising the steps of:

importing a master pinlist to a computer program;

importing a bonding diagram to a computer program;

comparing the bonding diagram to the master pinlist;

generating an extended pinlist based upon the master pinlist and the bonding diagram;

verifying substrate artwork against the extended pinlist; and

generating a report listing the errors in the substrate artwork;

the substrate artwork describing connections between contacts of a substrate of the wirebond ball grid array.

9. The method of claim 8 further comprising a step of identifying errors in the master pinlist.

10. The method of claim 9 further comprising a step of generating a report listing the errors in the master pinlist.

11. The method of claim 10 further comprising a step of modifying the master pinlist.

12. The method of claim 8 wherein the step of comparing a bonding diagram to the master pinlist comprises identifying mismatches between the bonding diagram and the master pinlist.

13. The method of claim 12 further comprising a step of generating a report listing the mismatches between the bonding diagram and the master pinlist.

14. The method of claim 13 further comprising a step of modifying the bonding diagram using auto-centering and auto-scaling.

15. A method of producing a wirebond ball grid array, the method comprising the steps of:

importing a master pinlist to a computer program;

importing a bonding diagram to a computer program;

comparing the bonding diagram to the master pinlist and identifying mismatches between the bonding diagram and the master pinlist;

generating a report listing the mismatches between the bonding diagram and the master pinlist;

modifying the bonding diagram using auto-centering and auto-scaling;

generating an extended pinlist based upon the master pinlist and the bonding diagram;

verifying substrate artwork against the extended pinlist;

generating a report listing the errors in the substrate artwork; and

generating a third report listing errors between the substrate artwork and the extended pinlist.

16. The method of claim 15 further comprising a step of modifying the substrate artwork.

17. The method of claim 16 further comprising a step of producing a wirebond ball grid array based upon modified substrate artwork.

18. A method of producing a ball grid array, the method comprising the steps of:

importing a master pinlist to a computer program;

identifying errors in the master pinlist;

modifying the master pinlist;

generating a first report listing the errors in the master pinlist;

importing a bonding diagram to the computer program;

comparing a bonding diagram to the master pinlist;

generating a second report listing the mismatches between the bonding diagram and the master pinlist;

modifying the bonding diagram;

verifying substrate artwork against the master pinlist;

generating a third report listing errors between the master pinlist, the bonding diagram and the substrate artwork;

modifying the substrate artwork; and

producing a wirebond ball grid array based upon the modified substrate artwork.

19. A method of producing a wirebond ball grid array, the method comprising the steps of:

importing a master pinlist to a computer program;

importing substrate artwork to the computer; and

verifying, by the computer program, a bonding diagram against the master pinlist and the substrate artwork;

the substrate artwork describing connections between contacts of a substrate of the wirebond ball grid array.

20. The method of claim 19 further comprising a step of identifying errors in the master pinlist.

21. The method of claim 19 further comprising a step of generating a report listing the errors in the master pinlist.

22. The method of claim 19 further comprising a step of comparing a bonding diagram to the master pinlist to identify mismatches between the bonding diagram and the master pinlist.

23. The method of claim 22 further comprising a step of generating a report listing the mismatches between the bonding diagram and the master pinlist.

24. The method of claim 19 further comprising a step of developing an extended pinlist.

25. The method of claim 24 further comprising a step of generating a report listing errors between the substrate artwork and the extended pinlist.

26. A system for producing a wirebond ball grid array, the system comprising:

means for importing a master pinlist to a computer program;

means for importing a bonding diagram to the computer program; and

means for verifying, by the computer program, substrate artwork against the master pinlist and the bonding diagram;

the substrate artwork describing connections between contacts of a substrate of the wirebond ball grid array.

27. The system of claim 26 further comprising means for identifying errors in the master pinlist.

28. The system of claim 27 further comprising means for generating a report listing the errors in the master pinlist.

29. The system of claim 26 further comprising means for comparing a bonding diagram to the master pinlist to identify mismatches between the bonding diagram and the master pinlist.

30. The system of claim 29 further comprising means for generating a report listing the mismatches between the bonding diagram and the master pinlist.

31. The system of claim 26 further comprising means for developing an extended pinlist.

32. The system of claim 26 further comprising means for generating a report listing errors between the master pinlist, the bonding diagram and the substrate artwork.

33. The system of claim 26 further comprising means for producing an integrated circuit package based upon the substrate artwork.