Method and apparatus for producing a packaged integrated circuit
First Claim
1. A method of producing a wirebond ball grid array, the method comprising the steps of:
- importing a master pinlist to a computer program;
importing a bonding diagram to the computer program; and
verifying, by the computer program, substrate artwork against the master pinlist and the bonding diagram;
the substrate artwork describing connections between contacts of a substrate of the wirebond ball grid array.
1 Assignment
0 Petitions
Accused Products
Abstract
A method of producing a wirebond ball grid array package is described. The method comprises the steps of importing a master pinlist to a computer program, importing a bonding diagram to the computer program, and verifying, by the computer program, substrate artwork against the master pinlist and the bonding diagram. A method of producing a wirebond ball grid array package according to an alternative embodiment comprises the steps of importing a master pinlist to a computer program, importing substrate artwork to the computer program, and verifying, by the computer program, a bonding diagram against the master pinlist and the substrate artwork. Finally, a system for verifying substrate artwork comprises means for importing a master pinlist to a computer program, means for importing a bonding diagram to the computer program, and means for verifying, by the computer program, the substrate artwork against the master pinlist and the bonding diagram.
8 Citations
33 Claims
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1. A method of producing a wirebond ball grid array, the method comprising the steps of:
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importing a master pinlist to a computer program; importing a bonding diagram to the computer program; and verifying, by the computer program, substrate artwork against the master pinlist and the bonding diagram; the substrate artwork describing connections between contacts of a substrate of the wirebond ball grid array. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of producing a wirebond ball grid array, the method comprising the steps of:
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importing a master pinlist to a computer program; importing a bonding diagram to a computer program; comparing the bonding diagram to the master pinlist; generating an extended pinlist based upon the master pinlist and the bonding diagram; verifying substrate artwork against the extended pinlist; and generating a report listing the errors in the substrate artwork; the substrate artwork describing connections between contacts of a substrate of the wirebond ball grid array. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of producing a wirebond ball grid array, the method comprising the steps of:
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importing a master pinlist to a computer program; importing a bonding diagram to a computer program; comparing the bonding diagram to the master pinlist and identifying mismatches between the bonding diagram and the master pinlist; generating a report listing the mismatches between the bonding diagram and the master pinlist; modifying the bonding diagram using auto-centering and auto-scaling; generating an extended pinlist based upon the master pinlist and the bonding diagram; verifying substrate artwork against the extended pinlist; generating a report listing the errors in the substrate artwork; and generating a third report listing errors between the substrate artwork and the extended pinlist. - View Dependent Claims (16, 17)
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18. A method of producing a ball grid array, the method comprising the steps of:
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importing a master pinlist to a computer program; identifying errors in the master pinlist; modifying the master pinlist; generating a first report listing the errors in the master pinlist; importing a bonding diagram to the computer program; comparing a bonding diagram to the master pinlist; generating a second report listing the mismatches between the bonding diagram and the master pinlist; modifying the bonding diagram; verifying substrate artwork against the master pinlist; generating a third report listing errors between the master pinlist, the bonding diagram and the substrate artwork; modifying the substrate artwork; and producing a wirebond ball grid array based upon the modified substrate artwork.
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19. A method of producing a wirebond ball grid array, the method comprising the steps of:
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importing a master pinlist to a computer program; importing substrate artwork to the computer; and verifying, by the computer program, a bonding diagram against the master pinlist and the substrate artwork; the substrate artwork describing connections between contacts of a substrate of the wirebond ball grid array. - View Dependent Claims (20, 21, 22, 23, 24, 25)
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26. A system for producing a wirebond ball grid array, the system comprising:
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means for importing a master pinlist to a computer program; means for importing a bonding diagram to the computer program; and means for verifying, by the computer program, substrate artwork against the master pinlist and the bonding diagram; the substrate artwork describing connections between contacts of a substrate of the wirebond ball grid array. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33)
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Specification