Sensor package and method
First Claim
Patent Images
1. A sensor package, comprising:
- an enclosure;
a diaphragm coupled to said enclosure, wherein said diaphragm is configured to receive vibrations from an ambient environment;
a pressure sensing element disposed inside said enclosure; and
a pressure transfer medium disposed inside said enclosure and proximate said pressure sensing element, said pressure transfer medium comprising;
a fluid; and
a plurality of filler particles suspended in said fluid, wherein said filler particles serve to reduce a coefficient of thermal expansion of said pressure transfer medium.
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Abstract
A sensor package and method are described. The sensor package includes an enclosure, a diaphragm coupled to the enclosure. The diaphragm is configured to receive vibrations from an ambient environment. Further, the sensor package includes a pressure sensing element disposed inside the enclosure, and a pressure transfer medium disposed inside the enclosure and proximate the pressure sensing element, where the pressure transfer medium includes a fluid, and a plurality of filler particles suspended in the fluid. The filler particles serve to reduce a coefficient of thermal expansion of the pressure transfer medium.
60 Citations
23 Claims
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1. A sensor package, comprising:
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an enclosure; a diaphragm coupled to said enclosure, wherein said diaphragm is configured to receive vibrations from an ambient environment; a pressure sensing element disposed inside said enclosure; and a pressure transfer medium disposed inside said enclosure and proximate said pressure sensing element, said pressure transfer medium comprising; a fluid; and a plurality of filler particles suspended in said fluid, wherein said filler particles serve to reduce a coefficient of thermal expansion of said pressure transfer medium. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A fluidic medium having a coefficient of thermal expansion no greater than 500 ppm/°
- C., comprising;
a fluid; and a plurality of filler particles suspended in said fluid, wherein a coefficient of thermal expansion of said plurality of filler particles is no greater than about 5 ppm/°
C. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
- C., comprising;
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19. A method of manufacturing a sensor package, comprising:
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providing an enclosure having a base; coupling a pressure sensing element to said base; disposing a pressure transfer medium in said enclosure proximate said pressure sensing element, wherein a coefficient of thermal expansion of said pressure transfer medium is no greater than 500 ppm/°
C.; anddisposing a diaphragm on said enclosure to seal said enclosure. - View Dependent Claims (20, 21, 22, 23)
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Specification