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Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length

  • US 7,021,915 B2
  • Filed: 11/12/2004
  • Issued: 04/04/2006
  • Est. Priority Date: 08/29/2000
  • Status: Expired due to Fees
First Claim
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1. An apparatus for providing at least an underfilled encapsulant structure for a flip-chip configured semiconductor device having a plurality of external conductive elements projecting from an active surface thereof, the apparatus comprising:

  • a reservoir;

    a platform disposed in the reservoir and having an upper surface for supporting at least one semiconductor die thereon;

    a drive assembly operably configured for tilting the platform to at least one selected acute angle to the horizontal within the reservoir;

    a liquid displacement structure for selectively varying a surface level of a curable liquid material contained in the reservoir; and

    a source of electromagnetic radiation configured to generate, focus and traverse a substantially vertical beam of electromagnetic radiation over the platform.

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