Method and device for protecting micro electromechanical systems structures during dicing of a wafer
First Claim
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1. A method for protecting a MEMS wafer during a dicing, comprising:
- (a) mounting, upon a backside of the MEMS wafer, a layer of dicing tape, the MEMS wafer having a plurality of MEMS structure sites on a front side and a plurality of through holes, each through hole corresponding to a MEMS structure site, the through holes being formed such that each through hole penetrates through the wafer from the backside of the wafer to the front side;
(b) mounting, upon the front side of the MEMS wafer, prior to dicing, a wafer cap to produce a laminated MEMS wafer, the wafer cap having a first side and a second side, the first side being opposite of the second side, the first side of the wafer cap being recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer, the second side of the wafer being substantially planar;
(c) dicing the MEMS wafer into a plurality of dies such that each die includes a MEMS structure site and a corresponding through hole; and
(d) mounting, upon the dicing tape, a layer of transfer tape.
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Abstract
A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
39 Citations
29 Claims
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1. A method for protecting a MEMS wafer during a dicing, comprising:
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(a) mounting, upon a backside of the MEMS wafer, a layer of dicing tape, the MEMS wafer having a plurality of MEMS structure sites on a front side and a plurality of through holes, each through hole corresponding to a MEMS structure site, the through holes being formed such that each through hole penetrates through the wafer from the backside of the wafer to the front side; (b) mounting, upon the front side of the MEMS wafer, prior to dicing, a wafer cap to produce a laminated MEMS wafer, the wafer cap having a first side and a second side, the first side being opposite of the second side, the first side of the wafer cap being recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer, the second side of the wafer being substantially planar; (c) dicing the MEMS wafer into a plurality of dies such that each die includes a MEMS structure site and a corresponding through hole; and (d) mounting, upon the dicing tape, a layer of transfer tape. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 15, 16, 17, 18, 19, 20, 21, 22, 26, 27, 28, 29)
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14. The method as claimed in 1, wherein a height of the perforated tape prevents electrostatically induced damage.
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23. The method as claimed in 19, wherein a height of the spacer layer prevents the wafer cover from deflecting in such a manner to come in contact with the MEMS structures.
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24. The method as claimed in 19, wherein a height of the spacer layer prevents electrostatically induced damage to the MEMS wafer.
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25. The method as claimed in 19, wherein a height of the spacer layer prevents electrostatically induced damage to the MEMS wafer and prevents the wafer cover from deflecting in such a manner to come in contact with the MEMS structures.
Specification