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Method for making a semiconductor die package

  • US 7,022,548 B2
  • Filed: 12/22/2003
  • Issued: 04/04/2006
  • Est. Priority Date: 06/15/2001
  • Status: Active Grant
First Claim
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1. A method for forming a semiconductor die package, the method comprising:

  • a) providing a mask having an aperture on a semiconductor substrate, wherein a conductive region is on the semiconductor substrate and the aperture in the mask is disposed over the conductive region;

    b) placing a pre-formed conductive column within the aperture; and

    c) bonding the pre-formed conductive column to the conductive region, wherein the pre-formed conductive column has substantially the same shape before and after bonding.

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