Carrier with metal bumps for semiconductor die packages
First Claim
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1. A semiconductor die package comprising:
- (a) a carrier comprising a metal layer, a die attach region, and a plurality of bumps formed in the metal layer; and
(b) a semiconductor die electrically coupled to the die attach region of the carrier,wherein the plurality of bumps are stamped bumps and are arranged around the die attach region, and wherein each of the bumps has a height that is greater than or equal to a thickness of the semiconductor die.
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Abstract
A carrier for a semiconductor die package is disclosed. In one embodiment, the carrier includes a metal layer and a plurality of bumps formed in the metal layer. The bumps can be formed by stamping.
99 Citations
17 Claims
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1. A semiconductor die package comprising:
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(a) a carrier comprising a metal layer, a die attach region, and a plurality of bumps formed in the metal layer; and (b) a semiconductor die electrically coupled to the die attach region of the carrier, wherein the plurality of bumps are stamped bumps and are arranged around the die attach region, and wherein each of the bumps has a height that is greater than or equal to a thickness of the semiconductor die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor die package comprising:
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(a) a carrier comprising metal layer, a die attach region, and a plurality of stamped bumps formed in the metal layer around the die attach region; (b) a semiconductor die comprising a vertical metal oxide semiconductor field effect transistor (MOSFET) device having a source region, a gate region, and a drain region, wherein the drain region is electrically coupled to and proximate to the die attach region of the carrier, and the source region and the gate region are distal to the die attach region, and wherein the plurality of stamped bumps in the carrier are arranged around the semiconductor die; and (c) a plurality of solder deposits disposed on the semiconductor die. - View Dependent Claims (11, 12, 13)
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14. A carrier for a semiconductor die package, the carrier comprising:
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a metal layer; a plurality of stamped bumps formed in the metal layer; a die attach region for receiving a semiconductor die, wherein the die attach region is in the metal layer and is disposed between and connects stamped bumps on opposite sides of the semiconductor die, wherein each of the stamped bumps in the plurality of bumps has a height greater than the semiconductor die. - View Dependent Claims (15, 16, 17)
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Specification