Bonding pad and via structure design

• US 7,023,090 B2
• Filed: 01/29/2003
• Issued: 04/04/2006
• Est. Priority Date: 01/29/2003
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Lee, Tze-Liang, Huang, Tai-Chun
• Primary Examiner(s): Graybill, David E.
• Application Number:
  US10/353,554
• Publication Number:
  US 20040145045A1
• Time in Patent Office: 1,161 Days
• Field of Search: 438/612, 438/926, 438/FOR.354, 438/FOR.355, 438/666, 257/758, 257/762, 257/765, 257/773, 257/775, 257/776, 228/180.22
• US Class Current: 257/756
• CPC Class Codes: H01L 2224/02166 Collar structures
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05093 of a plurality of vias
• CPC Class Codes: H01L 2224/05096 Uniform arrangement, i.e. array
• CPC Class Codes: H01L 2224/05556 in side view
• CPC Class Codes: H01L 23/5329 Insulating materials
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/05042 Si3N4

Abstract

A bonding pad design, comprising: a substrate; a lower series of metal pads upon the substrate; and an intermediate series of metal pads over the lower series of metal pads. The lower series of metal pads and the intermediate series of metal pads being connected by a respective series of intermediate interconnects and each series of intermediate metal pads being interlocked by a respective series of extensions.

Claims

1. A bonding pad design, comprising:

a semiconductor substrate;

a first dielectric layer over the semiconductor substrate;

at least first and second interlocked conductive pads formed within the first dielectric layer, the first and second conductive pads being electrically isolated from each other;

a second dielectric layer over the first dielectric layer; and

at least first and second bonding pads formed in the second dielectric layer, the first and second bonding pads being electrically isolated from each other, and wherein the first conductive pad is electrically coupled to the first bonding pad and the second conductive pad is electrically coupled to the second bonding pad.

2. The design of claim 1, wherein the first dielectric layer is comprised of a dielectric material having a dielectric constant of less than about 3.0.

3. The design of claim 1, further including an undoped silica glass dielectric layer over the first dielectric layer.

4. The design of claim 1, further including a second dielectric layer between the first dielectric layer and the semiconductor substrate;

the second dielectric layer being comprised of a dielectric material having a dielectric constant of less than about 3.0.

5. A bonding pad design, comprising:

a substrate;

a lower series of metal pads upon the substrate, the metal pads in the lower series being electrically isolated from each other; and

an intermediate series of metal pads over the lower series of metal pads, the metal pads in the intermediate series being electrically isolated from each other, and wherein corresponding ones of the lower series of metal pads and the intermediate series of metal pads are electrically connected by a respective series of intermediate interconnects, the interconnects of the intermediate series being electrically isolated from each other, and wherein at least two of the series of intermediate metal pads are interlocked by a respective series of extensions.

6. The design of claim 5, further including a top series of bonding pads over the intermediate series of metal pads, and an upper series of interconnects, the interconnects of the upper series being electrically isolated from each other, and the bonding pads of the top series being electrically isolated from each other, and being electrically connected to respective metal pads of the intermediate series of metal pads by respective interconnects of the upper series of interconnects.

7. The design of claim 5, wherein the respective series of extensions include a respective series of horizontal extensions and a respective series of vertical extensions.

8. The design of claim 5, wherein the respective series of extensions include a respective series of horizontal extensions and a respective series of vertical extensions;

the respective series of horizontal and vertical extensions extending towards adjacent ones of the intermediate and lower series of metal pads.

9. The design of claim 5, wherein the respective series of extensions include a respective series of horizontal extensions.

10. The design of claim 5, wherein the respective series of extensions include a respective series of horizontal extensions extending towards adjacent ones of the intermediate series of metal pads.

11. The design of claim 5, wherein the respective series of extensions include a respective series of vertical extensions.

12. The design of claim 5, wherein the respective series of extensions include a respective series of vertical extensions extending towards adjacent ones of the lower series of metal pads.

13. The design of claim 5, wherein the lower series of metal pads, the intermediate series of metal pads and the respective series of intermediate interconnects are comprised of copper or aluminum.

14. The design of claim 5, wherein the lower series of metal pads, the intermediate series of metal pads and the respective series of intermediate interconnects are comprised of copper.

15. The design of claim 5, wherein a dielectric layer embeds the lower series of metal pads and respective IMD layers embed the intermediate series of metal pads.

16. The design of claim 5, wherein a dielectric layer embeds the lower series of metal pads and respective IMD layers embed the intermediate series of metal pads;

the dielectric layer and the respective IMD layers being comprised of undoped silica glass, fluorine-doped silica glass or a dielectric material having a dielectric constant of less than about 3.0.

17. The design of claim 5, wherein a dielectric layer embeds the lower series of metal pads and respective IMD layers embed the intermediate series of metal pads;

the dielectric layer and the respective IMD layers being comprised of a dielectric material having a dielectric constant of less than about 3.0.

18. The design of claim 5, wherein a dielectric layer embeds the lower series of metal pads and respective IMD layers embed the intermediate series of metal pads and the respective series of intermediate interconnects.

19. The design of claim 5, wherein the respective series of extensions include a respective series of horizontal extensions and a respective series of vertical extensions;

the horizontal extensions being in a respective series of horizontal planes;

each of the intermediate series of metal pads comprising a series of metal pads in one of the respective series of horizontal planes;

each of the series of metal pads including at least one inner metal pad and two outer metal pads on either side of the inner metal pad;

the at least one inner metal pad having a series of extensions extending towards the two outer metal pads;

the two outer metal pads having a series of extensions extending towards, and interlocking with, the series of inner metal pad extensions.

20. The design of claim 5, wherein the respective series of extensions include a respective series of horizontal extensions and a respective series of vertical extensions;

the horizontal extensions being in a respective series of horizontal planes;

each of the intermediate series of metal pads comprising a series of metal pads in one of the respective series of horizontal planes;

each of the series of metal pads including at least one inner metal pad and two outer metal pads on either side of the inner metal pad;

the at least one inner metal pad having a series of opposing extensions extending towards the two outer metal pads;

the two outer metal pads having a series of extensions extending towards, and interlocking with, the series of inner metal pad opposing extensions.

21. The design of claim 5, wherein the respective series of extensions include a respective series of horizontal extensions and a respective series of vertical extensions;

the horizontal extensions being in a respective series of horizontal planes;

each of the intermediate series of metal pads comprising a series of metal pads in one of the respective series of horizontal planes;

each of the series of metal pads including at least one inner metal pad and two outer metal pads on either side of the inner metal pad;

the at least one inner metal pad having a series of non-opposing extensions extending towards the two outer metal pads;

the two outer metal pads having a series of extensions extending towards, and interlocking with, the series of inner metal pad non-opposing extensions.

22. The design of claim 5, wherein the respective series of extensions include a respective series of horizontal extensions and a respective series of vertical extensions;

the horizontal extensions being in a respective series of horizontal planes;

each of the intermediate series of metal pads comprising a series of metal pads in one of the respective series of horizontal planes;

each of the series of metal pads including at least one inner metal pad and two outer metal pads on either side of the inner metal pad;

the at least one inner metal pad having a series of extensions extending towards the two outer metal pads;

the two outer metal pads having a series of extensions extending towards, and interlocking with, the series of inner metal pad extensions;

at least one of the inner metal pad and the at least two outer metal pads of each series of metal pads being dummy metal pads.

23. The design of claim 5, wherein the each of the intermediate series of metal pads comprise a series of parallel metal structures;

the respective series of extensions comprising a series of parallel dummy metal structures interleaved with the series of parallel metal structures comprising the intermediate series of metal pads to interlock the intermediate series of metal pads.

24. The design of claim 5, wherein the each of the intermediate series of metal pads comprise finger structures;

the respective finger structures comprising respective fingers;

the respective series of extensions comprising dummy regions within the respective fingers.

25. A bonding pad design, comprising:

a substrate;

a lower series of metal pads upon the substrate, the metal pads of the lower series being electrically isolated from each other;

an intermediate series of metal pads over the lower series of metal pads, the metal pads in the intermediate series being electrically isolated from each other, and wherein corresponding ones of the lower series of metal pads and the intermediate series of metal pads are electrically connected by a respective series of intermediate interconnects, the interconnects of the intermediate series being electrically isolated from each other, and wherein at least two of the series of intermediate metal pads are interlocked by a respective series of extensions; and

a top series of bonding pads over the intermediate series of metal pads, and an upper series of interconnects, the interconnects of the upper series being electrically isolated from each other, and the bonding pads of the top series being electrically isolated from each other and being electrically connected to corresponding ones of the intermediate series of metal pads by respective interconnects of the upper series of interconnects.

26. The design of claim 25, wherein the respective series of extensions include a respective series of horizontal extensions and a respective series of vertical extensions;

the respective series of horizontal and vertical extensions extending towards adjacent ones of the lower and intermediate series of metal pads.

27. The design of claim 25, wherein the respective series of extensions include a respective series of horizontal extensions extending towards adjacent ones of the intermediate series of metal pads.

28. The design of claim 25, wherein the respective series of extensions include a respective series of vertical extensions extending towards adjacent ones of the lower series of metal pads.

29. The design of claim 25, wherein a dielectric layer embeds the lower series of metal pads and respective IMD layers embed the intermediate series of metal pads;

the dielectric layer and the respective IMD layers being comprised of undoped silica glass, fluorine-doped silica glass or a dielectric material having a dielectric constant of less than about 3.0.

30. The design of claim 25, wherein a dielectric layer embeds the lower series of metal pads and respective IMD layers embed the intermediate series of metal pads and the respective series of intermediate interconnects.

31. The design of claim 25, wherein the top series of bonding pads are square shaped.

32. The design of claim 25, wherein the top series of bonding pads are rectangular shaped.

33. A bonding pad design, comprising:

a substrate;

a lower series of metal pads upon the substrate, the metal pads in the lower series being electrically isolated from each other;

an intermediate series of metal pads over the lower series of metal pads, the metal pads in the intermediate series being electrically isolated from each other, and wherein corresponding ones of the lower series of metal pads and the intermediate series of metal pads are electrically connected by a respective series of intermediate interconnects, the interconnects of the intermediate series being electrically isolated from each other, and wherein at least two of the series of intermediate metal pads are interlocked by a respective series of extensions; and

a top series of bonding pads over the intermediate series of metal pads, and an upper series of interconnects, the interconnects of the upper series being electrically isolated from each other, and the bonding pads of the top series being electrically isolated from each other, and being electrically connected to corresponding ones of the intermediate series of metal pads by respective interconnects of the upper series of interconnects;

wherein the lower series of metal pads, the intermediate series of metal pads, the respective series of intermediate interconnects and the upper series of interconnects are comprised of aluminum or copper.

34. The design of claim 33, wherein a dielectric layer embeds the lower series of metal pads and respective IMD layers embed the intermediate series of metal pads;

the dielectric layer and the respective IMD layers being comprised of undoped silica glass, fluorine-doped silica glass or a dielectric material having a dielectric constant of less than about 3.0.

35. The design of claim 33, wherein the respective series of extensions include a respective series of horizontal extensions and a respective series of vertical extensions;

the horizontal extensions being in a respective series of horizontal planes;

each of the intermediate series of metal pads comprising a series of metal pads in one of the respective series of horizontal planes;

each of the series of metal pads including at least one inner metal pad and two outer metal pads on either side of the inner metal pad;

the at least one inner metal pad having a series of extensions extending towards the two outer metal pads;

the two outer metal pads having a series of extensions extending towards, and interlocking with, the series of inner metal pad extensions.

36. The design of claim 33, wherein the respective series of extensions include a respective series of horizontal extensions and a respective series of vertical extensions;

the horizontal extensions being in a respective series of horizontal planes;

each of the intermediate series of metal pads comprising a series of metal pads in one of the respective series of horizontal planes;

each of the series of metal pads including at least one inner metal pad and two outer metal pads on either side of the inner metal pad;

the at least one inner metal pad having a series of opposing extensions extending towards the two outer metal pads;

the two outer metal pads having a series of extensions extending towards, and interlocking with, the series of inner metal pad opposing extensions.

37. The design of claim 33, wherein the respective series of extensions include a respective series of horizontal extensions and a respective series of vertical extensions;

the horizontal extensions being in a respective series of horizontal planes;

each of the intermediate series of metal pads comprising a series of metal pads in one of the respective series of horizontal planes;

each of the series of metal pads including at least one inner metal pad and two outer metal pads on either side of the inner metal pad;

the at least one inner metal pad having a series of extensions extending towards the two outer metal pads;

the two outer metal pads having a series of extensions extending towards, and interlocking with, the series of inner metal pad extensions;

at least one of the inner metal pad and the at least two outer metal pads of each series of metal pads being dummy metal pads.

38. The design of claim 33, wherein the top series of bonding pads comprise at least two bonding pads separated by a distance of from about 2 to 400 μ

m.

39. A bonding pad structure comprising:

a first dielectric layer having first and second bonding pads positioned thereon, the first and second bonding pads being electrically isolated from each other;

a second dielectric layer positioned under the first dielectric layer;

a third dielectric layer positioned under the second dielectric layer;

first and second conductive pads positioned in the second dielectric layer, the first and second conductive pads being electrically isolated from each other, and being electrically connected to the first and second bonding pads respectively, wherein the first and second conductive pads include extensions for interlacing with one another; and

third and fourth conductive pads positioned in the third dielectric layer, the third and fourth conductive pads being electrically isolated from each other, and being electrically connected to the first and second conductive pads respectively, wherein the third and fourth conductive pads include extensions for interlacing with one another, and wherein the extensions of the third and fourth conductive pads are reversed from those of the first and second conductive pads.

40. The bonding pad structure of claim 39 wherein at least one of the first and third conductive pads has at least a portion that is offset in a horizontal direction with respect to the first bonding pad.

41. The bonding pad structure of claim 40 wherein at least one of the second and fourth conductive pads is aligned in a horizontal direction with respect to the second bonding pad.

42. The bonding pad structure of claim 39 further comprising:

a fourth dielectric layer positioned under the third dielectric layer; and

fifth and sixth conductive pads positioned in the fourth dielectric layer, the fifth and sixth conductive pads being electrically isolated from each other, and being electrically connected to the third and fourth conductive pads respectively, wherein the fifth and sixth conductive pads include extensions for interlacing with one another, and wherein the extensions of the fifth and sixth conductive pads are identical to those of the first and second conductive pads.

43. The bonding pad structure of claim 42 wherein the fifth conductive pad has at least a portion that is offset in a horizontal direction with respect to the first bonding pad.