×

Endovascular graft with pressure, temperature, flow and voltage sensors

  • US 7,025,778 B2
  • Filed: 06/07/2002
  • Issued: 04/11/2006
  • Est. Priority Date: 06/07/2002
  • Status: Expired due to Fees
First Claim
Patent Images

1. A modular endoluminal prosthesis for repairing vasculature in the area of an aneurysm sac, comprising:

  • a first endovascular graft component; and

    a second endovascular graft component configured to be delivered within vasculature separate from the first endovascular graft component, the second endovascular graft component including mating structure that accomplishes mating the second endovascular graft component to the first endovascular graft component in vasculature and having one or more sensors attached at a juncture between the first endovascular graft component and the second endovascular graft component, wherein the sensors of the second endovascular graft component detect parameters in the aneurysm sac relating to an endoleak at the juncture of the first endovacular graft and the second endovascular graft.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×