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Method of fabricating microstructures and devices made therefrom

  • US 7,026,184 B2
  • Filed: 02/26/2003
  • Issued: 04/11/2006
  • Est. Priority Date: 02/26/2003
  • Status: Active Grant
First Claim
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1. A method of fabricating a micromachined device, comprising:

  • forming a composite thin film layer stack on a substrate, the composite thin film layer stack having a plurality of etch-resistant layers;

    directionally etching a first portion of the composite thin film layer stack selectively masked by a first etch-resistant layer;

    directionally etching a first portion of the substrate selectively masked by the first etch-resistant layer to define a first composite thin film microstructure;

    isotropically etching a second portion of the substrate for a controlled period of time to remove substrate material from under the first composite thin film microstructure;

    removing a portion of the first etch-resistant layer;

    directionally etching a second portion of the composite thin film layer stack selectively masked by a second etch-resistant layer; and

    directionally etching a third portion of the substrate selectively masked by the second etch-resistant layer to define a second microstructure, the second microstructure comprising a composite thin film layer stack portion and a substrate layer portion.

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