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Hermetic electric component package

  • US 7,026,223 B2
  • Filed: 03/28/2002
  • Issued: 04/11/2006
  • Est. Priority Date: 03/28/2002
  • Status: Expired due to Term
First Claim
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1. A process for fabricating an electric component package having a sealed cavity for accommodating an electric component, comprising the steps of:

  • etching a semiconductor base layer having first and second opposing surfaces to form at least one pedestal on said first surface;

    applying a layer of dielectric material to said first surface of said etched semiconductor base layer;

    grinding said dielectric layer to expose a surface of said at least one pedestal;

    establishing an electric component on said ground dielectric layer, said electric component having at least one port coupled to said exposed surface of said at least one pedestal;

    attaching a lid to said ground dielectric layer, said lid having a cavity for accommodating said electric component; and

    grinding said semiconductor base layer on said second surface to expose said dielectric layer, said at least one pedestal forming a conductive via extending through said dielectric layer.

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