Hermetic electric component package
First Claim
1. A process for fabricating an electric component package having a sealed cavity for accommodating an electric component, comprising the steps of:
- etching a semiconductor base layer having first and second opposing surfaces to form at least one pedestal on said first surface;
applying a layer of dielectric material to said first surface of said etched semiconductor base layer;
grinding said dielectric layer to expose a surface of said at least one pedestal;
establishing an electric component on said ground dielectric layer, said electric component having at least one port coupled to said exposed surface of said at least one pedestal;
attaching a lid to said ground dielectric layer, said lid having a cavity for accommodating said electric component; and
grinding said semiconductor base layer on said second surface to expose said dielectric layer, said at least one pedestal forming a conductive via extending through said dielectric layer.
13 Assignments
0 Petitions
Accused Products
Abstract
An electric component package having a base and a lid, the base and lid defining a hermetically sealed cavity therebetween for accommodating an electric component. The base includes at least one conductive via extending therethrough, allowing control and/or input/output (I/O) ports associated with the electric component to be coupled to the conducive vias to pass signals between the sealed cavity and the exterior of the package without passing through the junction between the base and lid. The electric component package can be produced at the wafer level using conventional silicon wafer integrated circuit manufacturing machinery prior to separating the wafer into a plurality of devices.
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Citations
15 Claims
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1. A process for fabricating an electric component package having a sealed cavity for accommodating an electric component, comprising the steps of:
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etching a semiconductor base layer having first and second opposing surfaces to form at least one pedestal on said first surface; applying a layer of dielectric material to said first surface of said etched semiconductor base layer; grinding said dielectric layer to expose a surface of said at least one pedestal; establishing an electric component on said ground dielectric layer, said electric component having at least one port coupled to said exposed surface of said at least one pedestal; attaching a lid to said ground dielectric layer, said lid having a cavity for accommodating said electric component; and grinding said semiconductor base layer on said second surface to expose said dielectric layer, said at least one pedestal forming a conductive via extending through said dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification