Moisture-resistant electronic device package and methods of assembly
First Claim
1. An electronic device package comprising:
- a substrate;
a housing structure disposed on the substrate and comprising a plurality of raised sidewalls extending along the perimeter of the substrate defining a cavity in the housing structure;
a ledge on the plurality of raised sidewalls of the housing structure and surrounding the cavity; and
at least one channel disposed within at least one sidewall of the plurality of raised sidewalls and extending from the ledge to a bottom surface of the cavity.
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Accused Products
Abstract
Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
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Citations
19 Claims
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1. An electronic device package comprising:
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a substrate; a housing structure disposed on the substrate and comprising a plurality of raised sidewalls extending along the perimeter of the substrate defining a cavity in the housing structure; a ledge on the plurality of raised sidewalls of the housing structure and surrounding the cavity; and at least one channel disposed within at least one sidewall of the plurality of raised sidewalls and extending from the ledge to a bottom surface of the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of forming an electronic device package comprising:
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providing a substrate; forming a housing structure including sidewalls defining a cavity on the substrate; forming a ledge within the sidewalls, the ledge surrounding the cavity; forming at least one channel extending from the ledge to a bottom of the cavity; mounting an electronic device sensitive to light or other radiation within the cavity; covering the cavity with a transparent cover supported by the ledge; and injecting a sealant material into the at least one channel to simultaneously adhesively bond the transparent cover to the housing structure and cover at least a portion of the bottom surface of the cavity. - View Dependent Claims (17, 18, 19)
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Specification