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Semiconductor inspection system

  • US 7,026,615 B2
  • Filed: 02/13/2003
  • Issued: 04/11/2006
  • Est. Priority Date: 04/27/2001
  • Status: Expired due to Term
First Claim
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1. A method of matching an image of a pattern on a semiconductor device produced by a semiconductor inspection system and a template comprising a bit map of CAD data, the method comprising the steps of:

  • decomposing the edges of the pattern image;

    smoothing the edge-decomposed pattern image and the template; and

    matching the smoothed pattern image and the template.

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