Isolation circuit
First Claim
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1. An isolation circuit for wafer-level testing, comprising:
- a first probe pad located in the scribe area of a wafer and adapted to receive a first external control signal;
a second probe pad located in the scribe area and adapted to receive a second external control signal;
a part pad coupled to interior circuits of a microelectronic die and located in the interior area of the microelectronic die; and
an isolation device comprising a metal oxide semiconductor (MOS) transistor located in the scribe area and adapted to transfer the second external control signal from the second probe pad to the part pad in response to the first external control signal.
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Abstract
An isolation circuit includes a first pad adapted to receive a control signal and a second pad adapted to receive another signal. A third pad is coupled to a microelectronic die and a device is provided to transfer the other signal from the second pad to the third pad in response to the control signal.
109 Citations
33 Claims
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1. An isolation circuit for wafer-level testing, comprising:
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a first probe pad located in the scribe area of a wafer and adapted to receive a first external control signal; a second probe pad located in the scribe area and adapted to receive a second external control signal; a part pad coupled to interior circuits of a microelectronic die and located in the interior area of the microelectronic die; and an isolation device comprising a metal oxide semiconductor (MOS) transistor located in the scribe area and adapted to transfer the second external control signal from the second probe pad to the part pad in response to the first external control signal. - View Dependent Claims (2, 3, 4, 5)
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6. An isolation circuit far wafer-level testing, comprising:
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a first test pad located in the scribe area of a wafer and adapted to receive control signals generated external to the wafer; a second test pad located in the scribe area of a wafer and adapted to receive test signals generated external to the wafer; a part pad coupled to a microelectronic die and located in the interior area of the microelectronic die; a first device comprising a metal oxide semiconductor (MOS) transistor adapted to transfer the test signals from the second test pad to the part pad in response to a predetermined control signal; and a second device adapted to selectively prevent the second pad from being coupled to the third pad during a predetermined use of the microelectronic die. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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13. An isolation circuit located in a scribe area of a wafer and operable for assisting wafer-level testing comprising:
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a gate control pad located in the scribe area and adapted to receive a control signal; a plurality of test pads located in the scribe area and adapted to receive a test signal; a plurality of part pads each coupled to a microelectronic die on the wafer; a plurality of first devices located in the scribe area, each comprising a metal oxide semiconductor (MOS) transistor and each adapted to transfer the test signal from one of the plurality of test pads to a corresponding one of the plurality of part pads in response to the control signal; and at least one second device to selectively prevent the test pad from being coupled to the part pad. - View Dependent Claims (14, 15)
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16. An isolation circuit located in a scribe area of a wafer, comprising:
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a gate control pad located in the scribe area and adapted to receive a control signal; a plurality of test pads located in the scribe area and adapted to receive a test signal; a plurality of part pads each coupled to a microelectronic die; a plurality of first devices each comprising at least one metal oxide semiconductor (MOS) transistor and, adapted to transfer the test signal from one of the plurality of test pads to a corresponding one of the plurality of part pads in response to the control signal; at least one second device to selectively prevent the test pad from being coupled to the part pad; and a plurality of third devices, each third device being adapted to selectively disconnect the gate control pad from each of the first devices. - View Dependent Claims (17, 18)
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19. An isolation circuit for wafer-level testing comprising:
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a plurality of test pads located in the scribe area of a wafer arid adapted to receive test signals; a plurality of part pads each coupled to a microelectronic die; a plurality of first metal oxide semiconductor fMOS) devices to couple each of the plurality of test pads to an associated one of the plurality of part pads in response to an enable signal; an enable pad coupled to each of the first devices to receive the enable signal; and a disable pad coupled to each of the first devices to receive a disable signal. - View Dependent Claims (20, 21, 22)
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23. An isolation circuit for wafer-level testing comprising:
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a first pad located in a scribe area of a wafer and adapted to receive a control signal; a second pad located in a scribe area of a wafer and adapted to be coupled to a power source; a third pad coupled to a microelectronic die; and a metal oxide semiconductor (MOS) device adapted to couple the second pad to the third pad in response to the control signal during normal use of the microelectronic die.
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24. A microelectronic die, comprising:
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a first pad located in a scribe area of a wafer and adapted to receive a control signal; a second pad located in the scribe area and adapted to receive another signal; a third pad coupled to a component formed on the microelectronic die; and a metal oxide semiconductor (MOS) device adapted to transfer the other signal from the second pad to the third pad in response to the control signal. - View Dependent Claims (25, 26, 27, 28)
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29. A semiconductor wafer, comprising:
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a plurality of microelectronic dies on the semiconductor wafer and having scribe areas between the microelectronic dies; and at least one isolation circuit associated with each microelectronic die, the at least one isolation circuit including; a first probe pad located in the scribe areas and adapted to receive a control signal; a second probe pad located in the scribe areas and adapted to receive a test signal; a part pad coupled to the microelectronic die and located inside the die; and a device comprising a metal oxide semiconductor (MOS) transistor located in the scribe area and adapted to transfer the test signal from the second probe pad to the part pad in response to the control signal. - View Dependent Claims (30, 31)
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32. An electronic system, comprising:
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a processor; and a memory system coupled to the processor, wherein at least one of the processor and the memory system are formed on a microelectronic die including an isolation circuit on the microelectronic die and in scribe are as surrounding the microelectronic dies, the isolation circuit including; a first probe pad located in the scribe areas and adapted to receive a control signal; a second probe pad located in the scribe areas and adapted to receive a test signal; a part pad coupled to the microelectronic die and located inside the die; and a device comprising a metal oxide semiconductor (MOS) transistor located in the scribe area and adapted to transfer the test signal from the second probe pad to the part pad in response to the control signal. - View Dependent Claims (33)
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Specification