Package for optical semiconductor

• US 7,026,654 B2
• Filed: 04/03/2003
• Issued: 04/11/2006
• Est. Priority Date: 04/05/2002
• Status: Expired due to Fees

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Igaki, Masahiko, Atsuta, Akio, Ogura, Makoto, Kosaka, Tadashi
• Primary Examiner(s): Whitehead, Jr., Carl
• Assistant Examiner(s): Mitchell, James M.
• Application Number:
  US10/406,943
• Publication Number:
  US 20030189213A1
• Time in Patent Office: 1,104 Days
• Field of Search: 257/79, 257/80, 257/98, 257/100, 438/123
• US Class Current: 257/80
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers

Abstract

To provide a package for an optical semiconductor having a light-emitting device and a light-receiving device in one package, in which a groove is provided between the light-emitting device and the light-receiving device to thereby avoid rays of light from the light-emitting device to directly enter the light-receiving device.

Claims

1. A package for an optical semiconductor comprising

a wiring board on which a light-emitting device and a light-receiving device are mounted and which has a circuit pattern for wiring of said devices;

a surrounding member layer made of a resin material having a light transmittance property so as to cover outer surfaces of the light-emitting device and the light-receiving device;

a substrate member layer made of a transparent material covering the outer surface of the surrounding member layer; and

a straight groove formed in said surrounding member and said substrate member between the light-emitting device and the light-receiving device,

wherein said straight groove is filled with a material having light shielding property and, has a depth which extends from a side from which light beam emitted from the light-emitting device emerges outside and which does not reach said wiring board so that at least a conducting portion of the circuit pattern on said wiring board exists below said straight groove such that the light-emitting device and light-receiving device are connected electrically passing under the groove.

2. A package for an optical semiconductor according to claim 1, wherein a glass substrate layer having a light transmittance property is provided on the surrounding member layer.

3. A package for an optical semiconductor according to claim 2, wherein the glass substrate layer is a light diffraction member.

4. A package for an optical semiconductor according to claim 1, wherein a sheet member having a light-shielding property is inserted into the groove.

5. A package for an optical semiconductor according to claim 1, wherein surfaces of the groove are subjected to mirror surface finishing.