×

Compact electronics plenum

  • US 7,027,300 B2
  • Filed: 09/16/2003
  • Issued: 04/11/2006
  • Est. Priority Date: 09/16/2003
  • Status: Expired due to Fees
First Claim
Patent Images

1. A cooling system, comprising:

  • a plenum formed of a thermally conductive material and having a base including a plurality of passageways adapted to pass air therethrough, the passageways being defined by a plurality of fins extending outwardly from the base;

    the plenum further comprising a receptacle adapted to receive a heat generating component, the receptacle also extending from the base at a location proximate, but remote from, the fins, the receptacle being adapted to thermally transfer heat from the received heat generating component to the fins, wherein the base is comprised of a pair of electrically conductive portions separated from each other, and joined by, an electrically non-conductive portion, further comprising a pair of said receptacles, each said receptacle being coupled to a respective said conductive portion; and

    a fan adapted to create air flow across the base and through the passageways.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×