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Heat transfer device and method of making same

  • US 7,028,759 B2
  • Filed: 01/27/2004
  • Issued: 04/18/2006
  • Est. Priority Date: 06/26/2003
  • Status: Expired due to Fees
First Claim
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1. A capillary structure for a heat transfer device comprising:

  • a plurality of particles joined together by a brazing compound comprising about sixty-five percent weight copper and thirty-five percent weight gold such that fillets of said brazing compound are formed between adjacent ones of said plurality of particles so as to form a network of capillary passageways between said particles wherein at least one vapor vent is defined through said capillary structure.

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