Sensor detecting reflected light and method for its manufacture

• US 7,030,359 B2
• Filed: 03/07/2003
• Issued: 04/18/2006
• Est. Priority Date: 03/07/2002
• Status: Active Grant

• Current Assignee: Sartorius Lab Instruments GmbH & Co. KG (Sartorius AG)
• Original Assignee: CIS Institut Fur Mikrosensorik Ggmbh
• Inventors: Römhild, Dieter
• Primary Examiner(s): Allen, Stephone B.
• Application Number:
  US10/384,007
• Publication Number:
  US 20030168580A1
• Time in Patent Office: 1,138 Days
• Field of Search: 250/214.R, 250/214.1, 250/216, 250/221, 250/222.1, 204/456, 204/550, 204/645, 257/53, 257/59, 257/432, 65/174, 356444-446, 501/66, 501/67, 424/82.01, 385/147, 340555-557, 430/17, 430/314, 174/52.1
• US Class Current: 250/214.00R
• CPC Class Codes: G01S 17/04 Systems determining the presence of a target
• CPC Class Codes: G01S 7/4811 common to transmitter and receiver

Abstract

A reflected-light sensor includes a light emitter for emitting radiation onto an object to be measured and an optical receiver for receiving the reflected radiation from the object. The sensor includes a carrier for the light emitter and the optical receiver and a glass layer arranged on the carrier. The glass layer has transparent areas arranged above the light emitter and the optical receiver and light absorbing areas located in between.

Claims

1. A reflected-light sensor including a light emitter for emitting radiation onto an object to be measured and an optical receiver for receiving radiation from the object, comprising a carrier for said light emitter and said optical receiver and a glass layer arranged on said carrier having a total thickness, said glass layer having transparent areas and light-absorbing areas arranged within said glass layer and extending across the total thickness of the glass layer, wherein said transparent areas are arranged above said light emitter and said optical receiver and said light-absorbing areas are located in between said transparent areas and around said transparent areas.

2. The reflected-light sensor according to claim 1 comprising at least one sensor area formed by at least one receiver and at least one emitter and wherein said glass layer extends in one piece across said at least one sensor area.

3. The reflected-light sensor according to claim 1, wherein at least two glass layers are stacked one on top of the other, with their transparent areas offset sideways, to produce optical shutters with defined edge angles.

4. The reflected-light sensor according to claim 1 wherein said carrier comprises a silicon chip accommodating electronic components for emitting and detecting light and said glass layer is electrically connected to said silicon chip.

5. The reflected-light sensor according to claim 1, wherein said glass layer contains contacting and wiring elements.

6. A method for producing a glass layer having transparent and light-absorbing areas for a reflected-light sensor comprising the following steps:

(a) exposing to UV radiation a UV-sensitive glass layer having a total thickness in regions of light-absorbing areas to be created and arranged between receiver and emitter areas of a reflected-light sensor and around the receiver and emitter areas; and

(b) tempering said UV-sensitive glass layer to transform the exposed regions to light-absorbing areas that extend across the total thickness of the glass layer.

7. The method according to claim 6, wherein the light-absorbing areas in the glass layer are produced by micro-lithographic methods.

8. The method according to claim 6, wherein at least two glass layers are stacked one on top of the other and are connected with each other by diffusion bonds.

9. A reflected-light sensor including a light emitter for emitting radiation onto an object to be measured and an optical receiver for receiving said radiation reflected from the object, comprising a carrier for said light emitter and said optical receiver comprising a silicon chip accommodating electronic components for emitting and detecting light and a UV-sensitive glass layer arranged on said carrier and electrically connected to said silicon chip, said glass layer having transparent areas arranged above said light emitter and said optical receiver and light-absorbing areas located in between said transparent areas, wherein said light-absorbing areas are produced by locally limited ultraviolet radiation in a micro-lithographic process and subsequent tempering.

10. A reflected-light sensor including a light emitter for emitting radiation onto an object to be measured and an optical receiver for receiving said radiation reflected from the object, comprising a carrier for said light emitter and said optical receiver comprising a silicon chip accommodating electronic components for emitting and detecting light and a glass layer arranged on said carrier and electrically connected to said silicon chip, said glass layer having transparent areas arranged above said light emitter and said optical receiver and light-absorbing areas located in between said transparent areas.

11. A reflected-light sensor including a light emitter for emitting radiation onto an object to be measured and an optical receiver for receiving said radiation reflected from the object, comprising a carrier for said light emitter and said optical receiver and a glass layer arranged on said carrier having transparent areas arranged above said light emitter and said optical receiver and light-absorbing areas located in between said transparent areas;

wherein at least two glass layers are stacked one on top of the other, with their transparent areas offset sideways, to produce optical shutters with defined edge angles.

12. A method for producing a UV-sensitive glass layer for a reflected-light sensor comprising the following steps:

(a) exposing a UV-sensitive glass layer in selected areas corresponding to areas between receiver and emitter areas in a reflected-light sensor; and

(b) tempering said UV-sensitive glass layer to produce light-absorbing areas in said selected areas;

wherein at least two glass layers are stacked one on top of the other and are connected with each other by diffusion bonds.