High density integrated circuit package architecture
First Claim
1. An integrated circuit package comprising:
- a plurality of circuitry wafers each comprising a substrate on which is carried one or more integrated circuits with at least one wafer configured for signal communication outside the package; and
a plurality of cooling plates alternately layered with the circuitry wafers;
wherein the circuitry wafers and cooling plates are layered in a first direction that defines a first axis of the package, and wherein signal communication between circuitry wafers within the package occurs in a direction along the first axis;
wherein the cooling plates are configured to direct heat flow in a path that is transverse to the first axis;
wherein at least one of power, data signal and control signal communication is supplied to the package from a direction that is transverse to both the first axis and the direction of heat flow; and
comprising cooling plates that define flow conduits therethrough for coolant fluid, wherein each flow conduit has two conduit ends and wherein the conduit ends are aligned at two different positions on the side of the package, and wherein the package further comprises manifolds that provide a port through which to provide coolant fluid to a plurality of flow conduits and a port to collect cooling fluid from a plurality of flow conduits, and wherein the manifolds are configured to permit access to the side of the package for providing at least one of power, data signal and control signal communication to circuitry wafers in the package.
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Accused Products
Abstract
This invention relates to a high density architecture for an integrated circuit package (10) in which a plurality of circuit communication wafers (12) are disposed in a stack with a plurality of cooling plates (14) between them, and wherein circuit communication between the communication wafers (12) is provided from wafer to wafer through the cooling plates (14). In addition, the communication wafers (12) may have integrated circuit chips (18) deposited on both sides of the wafer, and chip-to-chip communication may be provided from one surface of the wafer to another through the wafer. The resulting integrated circuit package may have any desired geometrical shape and will permit heat exchange, power and data exchange to occur in three generally mutually orthogonal directions through the package.
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Citations
15 Claims
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1. An integrated circuit package comprising:
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a plurality of circuitry wafers each comprising a substrate on which is carried one or more integrated circuits with at least one wafer configured for signal communication outside the package; and a plurality of cooling plates alternately layered with the circuitry wafers; wherein the circuitry wafers and cooling plates are layered in a first direction that defines a first axis of the package, and wherein signal communication between circuitry wafers within the package occurs in a direction along the first axis; wherein the cooling plates are configured to direct heat flow in a path that is transverse to the first axis; wherein at least one of power, data signal and control signal communication is supplied to the package from a direction that is transverse to both the first axis and the direction of heat flow; and comprising cooling plates that define flow conduits therethrough for coolant fluid, wherein each flow conduit has two conduit ends and wherein the conduit ends are aligned at two different positions on the side of the package, and wherein the package further comprises manifolds that provide a port through which to provide coolant fluid to a plurality of flow conduits and a port to collect cooling fluid from a plurality of flow conduits, and wherein the manifolds are configured to permit access to the side of the package for providing at least one of power, data signal and control signal communication to circuitry wafers in the package. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11)
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2. An integrated circuit package comprising:
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a plurality of circuitry wafers each comprising a substrate on which is carried one or more integrated circuits with at least one circuitry wafer configured for signal communication outside the package; and a plurality of cooling plates alternately layered with the circuitry wafers; and comprising circuitry wafers and cooling plates configured so that integrated circuits on at least two circuitry wafers in the package communicate with each other through an intervening cooling plate; and further comprising cooling plates that define flow conduits therethrough for coolant fluid, wherein each flow conduit has two conduit ends and wherein the conduit ends are aligned at two different sides of the package, and wherein the package further comprises manifolds that provide a port through which to provide coolant fluid to a plurality of flow conduits and a port to collect cooling fluid from a plurality of flow conduits. - View Dependent Claims (12, 13)
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14. An integrated circuit package comprising:
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a plurality of circuitry wafers each comprising a substrate on which is carried one or more integrated circuits with at least one circuitry wafer configured for signal communication outside the package; and a plurality of cooling plates alternately layered with the circuitry wafers, including cooling plates that define flow conduits therethrough for coolant fluid, wherein each of the flow conduits has two conduit ends and wherein the conduit ends are aligned at two different sides of the package; and wherein the package further comprises a first manifold that provides a port through which to provide coolant fluid to a plurality of flow conduits and a second manifold that provides a port to collect cooling fluid from the plurality of flow conduits. - View Dependent Claims (15)
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Specification