Method for manufacturing electronic tag
First Claim
1. A method of manufacturing an electronic tag, comprising a first step of adhering a plurality of electronic tags to a surface of a double-faced adhesive tape, each electronic tag being provided with a rectangular lead constituting an antenna;
- a slit formed in a part of the lead and having an end extending to an outer edge of the lead;
a semiconductor chip mounted on the lead near the slit;
a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the lead facing to a semiconductor chip-mounting area across the slit; and
resin for sealing the semiconductor chip and the wire; and
a second step of packaging the double-faced adhesive tape to which the electronic tags are adhered, and then shipping the same.
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0 Petitions
Accused Products
Abstract
In the event of the shipment of electronic tags from a manufacturer to a customer, a number of the electronic tags required by the customer are adhered to a double-faced adhesive tape and then the double-faced adhesive tape is wound on a reel. Then, this reel is contained in a case and shipped to the customer. The electronic tag is adhered to an article in the following manner. That is, the double-faced adhesive tape is cut to obtain pieces of the electronic tags, and the cover tape on the rear surface of the double-faced adhesive tape is peeled, and then, the electronic tag is adhered to the article by the use of the double-faced adhesive tape.
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Citations
19 Claims
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1. A method of manufacturing an electronic tag, comprising a first step of adhering a plurality of electronic tags to a surface of a double-faced adhesive tape, each electronic tag being provided with a rectangular lead constituting an antenna;
- a slit formed in a part of the lead and having an end extending to an outer edge of the lead;
a semiconductor chip mounted on the lead near the slit;
a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the lead facing to a semiconductor chip-mounting area across the slit; and
resin for sealing the semiconductor chip and the wire; and
a second step of packaging the double-faced adhesive tape to which the electronic tags are adhered, and then shipping the same. - View Dependent Claims (2, 3, 4, 5, 6, 7)
- a slit formed in a part of the lead and having an end extending to an outer edge of the lead;
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8. A method of manufacturing an electronic tag, which is provided with a rectangular lead constituting an antenna;
- a slit formed in a part of the lead and having an end extending to an outer edge of the lead;
a semiconductor chip mounted on the lead near the slit;
a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the lead facing to a semiconductor chip-mounting area across the slit; and
resin for sealing the semiconductor chip and the wire,the method comprising the steps of; (a) preparing a lead frame in which a plurality of leads are arranged in parallel to each other, and both longitudinal ends of the leads are held by a pair of support frames extending in a direction perpendicular to the longitudinal direction of the leads; (b) mounting a semiconductor chip on each lead; (c) connecting the lead and the semiconductor chip with a wire; (d) sealing the semiconductor chip and the wire with resin; and (e) cutting both ends of the respective leads to separate the leads from the support frames. - View Dependent Claims (9)
- a slit formed in a part of the lead and having an end extending to an outer edge of the lead;
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10. A method of manufacturing an electronic tag, the electronic tag being provided with a rectangular lead constituting an antenna;
- a slit formed in a part of the lead and having an end extending to an outer edge of the lead;
a semiconductor chip mounted on the lead near the slit;
a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the lead facing to a semiconductor chip-mounting area across the slit; and
resin for sealing the semiconductor chip and the wire, comprising the steps of;(a) preparing a lead frame to which a plurality of the leads each constituting an antenna of an electronic tag are connected via support frames; (b) mounting a semiconductor chip on each lead of the lead frame, and then electrically connecting the lead to the semiconductor chip; (c) sealing the semiconductor chips mounted on the leads with resin, thereby producing a plurality of electronic tags; (d) after the step (c), adhering the lead frame having the plurality of electronic tags to a surface of a double-faced adhesive tape; (e) after the step (d), cutting the support frames of the lead frame to remove the same; (f) checking the quality of the electronic tags, which are adhered to the surface of the double-faced adhesive tape and electrically isolated from each other; and (g) after the step (f), packaging the double-faced adhesive tape to which the electronic tags are adhered, and then shipping the same. - View Dependent Claims (11, 12, 13)
- a slit formed in a part of the lead and having an end extending to an outer edge of the lead;
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14. A method of manufacturing an electronic tag, the electronic tag being provided with a rectangular lead constituting an antenna;
- a slit formed in a part of the lead and having an end extending to an outer edge of the lead;
a semiconductor chip mounted on the lead near the slit;
a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the lead facing to a semiconductor chip-mounting area across the slit; and
resin for sealing the semiconductor chip and the wire, comprising the steps of;(a) preparing a lead frame to which a plurality of the leads each constituting an antenna of an electronic tag are connected via support frames; (b) mounting a semiconductor chip on each lead of the lead frame, and then electrically connecting the lead to the semiconductor chip; (c) sealing the semiconductor chips mounted on the leads with resin, thereby producing electronic tags; (d) after the step (c), cutting the support frames of the lead frame to remove the same, thereby separating the electronic tags from the support frames; (e) checking quality of the electronic tags; (f) after the step (e), adhering a plurality of the electronic tags to a surface of a double-faced adhesive tape; and (g) packaging the double-faced adhesive tape to which the plurality of electronic tags are adhered, and then shipping the same. - View Dependent Claims (15, 16, 17)
- a slit formed in a part of the lead and having an end extending to an outer edge of the lead;
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18. A method comprising the steps of:
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providing a double-faced adhesive tape having a plurality of electronic tags disposed over substantially an entire surface thereof, each electronic tag being provided with a rectangular lead constituting an antenna;
a slit formed in a part of the lead and having an end extending to an outer edge of the lead;
a semiconductor chip mounted on the lead near the slit;
a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the lead facing to a semiconductor chip-mounting area across the slit; and
resin for sealing the semiconductor chip and the wire; andseparating a portion of the double-faced adhesive tape to obtain a piece including an electronic tag from the plurality of electronic tags. - View Dependent Claims (19)
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Specification