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Method for manufacturing electronic tag

  • US 7,030,763 B2
  • Filed: 01/14/2003
  • Issued: 04/18/2006
  • Est. Priority Date: 09/28/2001
  • Status: Expired due to Term
First Claim
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1. A method of manufacturing an electronic tag, comprising a first step of adhering a plurality of electronic tags to a surface of a double-faced adhesive tape, each electronic tag being provided with a rectangular lead constituting an antenna;

  • a slit formed in a part of the lead and having an end extending to an outer edge of the lead;

    a semiconductor chip mounted on the lead near the slit;

    a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the lead facing to a semiconductor chip-mounting area across the slit; and

    resin for sealing the semiconductor chip and the wire; and

    a second step of packaging the double-faced adhesive tape to which the electronic tags are adhered, and then shipping the same.

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