Electronic thermal management

• US 7,031,155 B2
• Filed: 01/06/2003
• Issued: 04/18/2006
• Est. Priority Date: 01/06/2003
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Chrysler, Gregory M., Sauciuc, Ioan
• Primary Examiner(s): Vortman, Anatoly
• Application Number:
  US10/337,909
• Publication Number:
  US 20040253130A1
• Time in Patent Office: 1,198 Days
• Field of Search: 361/678, 361/690, 361/694, 361/695, 361/697, 165/80.3, 165/122, 165/104.34, 165/80.4, 454184-186, 257712-722, 312/236, 312/223.1, 312/223.2, 312/223.3, 310311-371, 417/410.1, 417/436
• US Class Current: 361/695
• CPC Class Codes: F04D 33/00 Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type F04D35/00 takes precedence; hand-held fans A45B
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Piezoelectric fan assemblies are provided to provide a conduction path and forced convection for space-limited electronic devices in accordance with embodiments of the present invention. The fan blade of a piezoelectric fan is thermally coupled to the heat source, such as, but not limited to, the fins of a heat sink, the condenser of the heat pipe, and to the thermal mass of a heat spreader or block. The high amplitude resonant vibration of the fan blade causes formation of a high velocity unidirectional flow stream. Maximum airflow occurs on axes of the piezoelectric fan'"'"'s centerline, relative to both width and height dimensions. Air intake is above and below the swept out plane of the fan blade. The air flow provides forced convection for the fan blade and, secondarily, for the heat source.

Claims

1. An apparatus, comprising:

a heat source to generate heat;

a heat dissipation component thermally coupled to the heat source, the heat dissipation component having a planar shaped component defined by a first and a second surface, the first and the second surfaces being parallel to each other and bordered by at least one end, the first and second surfaces having surface areas greater than the at least one end, the planar shaped heat dissipation component to receive and transfer the generated heat away from the heat source; and

a piezoelectric fan coupled to the at least one end of the planar shaped heat dissipation component, the piezoelectric fan to facilitate dissipation of the transferred heat from the heat source, the piezoelectric fan having a substantially planar shape with a first and a second end, the first end being coupled to the at least one end of the heat dissipation component and the second end being located away from the at least one end of the heat dissipation component relative to the first end.

2. The apparatus of claim 1, wherein the first surface of the planar shaped heat dissipation component is located along a plane and the piezoelectric fan extends outwardly from the at least one end of the heat dissipation component in a direction that is substantially parallel with the plane.

3. The apparatus of claim 1, wherein the piezoelectric fan includes a blade, at least a portion of the blade coupled to a piezoelectric film element.

4. The apparatus of claim 1, wherein the apparatus is a laptop computer.

5. The apparatus of claim 4, wherein the planar shaped heat dissipation component is a vapor chamber.

6. The apparatus of claim 4, wherein the planar shaped heat dissipation component is coupled to the heat source via at least one component selected from the group consisting of a heat sink, evaporator and heat pipe.

7. The apparatus of claim 4, wherein the planar shaped heat dissipation component is located at a display section and the heat source is located at a base section.

8. The apparatus of claim 7, wherein the heat source located at the base section is flexibly coupled to the planar shaped heat dissipation component located at the display section by a heat pipe at a bendable point where the base section is coupled to the display section.

9. The apparatus of claim 1, wherein the apparatus is a wireless phone.

10. The apparatus of claim 9, wherein the heat source having a third surface, the third surface being substantially parallel to the first surface and coupled at least partially to the first surface of the heat dissipation component, the first surface having a surface area that is greater than the third surface of the heat source.

11. The apparatus of claim 9, wherein the planar shaped heat dissipation component is a component selected from the group consisting of a heat spreader and a circuit substrate.

12. The apparatus of claim 1, wherein the heat source is a microelectronic package.

13. A method of operation for dissipating heat remotely from a heat source in an electronic device, comprising:

generating heat from the heat source;

transferring the generated heat to a planar shaped heat dissipation component, the planar shaped heat dissipation component having a planar shaped component having a first and a second surface that are substantially parallel to each other and bordered by at least one end, the first and second surfaces having surface areas greater than the at least one end; and

dissipating the transferred heat from the planar shaped heat dissipation component by energizing at least a portion of a piezoelectric fan coupled to the at least one end of the planar shaped heat dissipation component, the piezoelectric fan having a planar shape with a first end and a second end, the first end being coupled to the at least one end of the heat dissipation component and the second end being a free end located away from the at least one end of the heat dissipation component relative to the first end, and the second end of the piezoelectric fan oscillating when the at least a portion of the piezoelectric fan is energized to facilitate the dissipation of the transferred heat from the heat dissipation component.

14. The method of claim 13, wherein the electronic device is a lap top computer and said transferring comprises of transferring the generated heat to the planar shaped heat dissipation component through at least one component selected from the group consisting of a heat sink, evaporator and heat pipe.

15. The method of claim 13, wherein the electronic device is a wireless phone and said transferring comprises of transferring the generated heat to a planar shaped heat dissipation component selected from the group consisting of a heat spreader and circuit substrate.

16. The method of claim 15, wherein the heat source includes a third surface, the third surface with a smaller surface area than the first surface of the planar shaped heat dissipation component, the third surface is substantially parallel to the first surface and at least partially coupled to the first surface, and wherein said transferring comprises transferring the generated heat from the third surface to at least a portion of the first surface of the planar shaped heat dissipation component.

17. The method of claim 13, wherein the piezoelectric fan comprises of a blade that is at least partially coupled to a piezoelectric film element and said dissipating comprises energizing the piezoelectric film element.

18. The method of claim 13, wherein the piezoelectric fan comprises of a blade and said dissipating comprises of oscillating the blade.

19. The method of claim 18, wherein said oscillating the blade to facilitate air circulation around the blade.