Methods for magnetically establishing an electrical connection with a contact of a semiconductor device component
First Claim
1. A method for establishing a temporary electrical contact with at least one semiconductor device, comprising:
- magnetically drawing at least one of a first member of an electrical connector and a contact that is in electrical communication with at least one semiconductor device toward the other of the first member and the contact to establish a temporary electrical contact between the first member and the contact; and
permitting an electrical current to flow from at least one of the electrical connector and the contact to the other of the contact and the electrical connector as the temporary electrical contact is maintained.
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Accused Products
Abstract
An electrical connector configured to nonrigidly apply force to a semiconductor substrate in directions substantially normal to a plane of the semiconductor substrate includes a first member with an electrically conductive element and a first attractive element and a second member that includes a support element and a second attractive element. Attractive forces, such as magnetic attraction, between the first and second attractive elements secure the first and second members of the electrical connector to the semiconductor substrate in a manner that facilitates communication between the electrically conductive element of the first member and one or more semiconductor devices carried upon the semiconductor substrate. The electrical connector may be used in stress testing of semiconductor devices or to otherwise establish an electrical connection between one or more semiconductor devices, a ground, and a power source.
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Citations
20 Claims
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1. A method for establishing a temporary electrical contact with at least one semiconductor device, comprising:
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magnetically drawing at least one of a first member of an electrical connector and a contact that is in electrical communication with at least one semiconductor device toward the other of the first member and the contact to establish a temporary electrical contact between the first member and the contact; and permitting an electrical current to flow from at least one of the electrical connector and the contact to the other of the contact and the electrical connector as the temporary electrical contact is maintained. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for stress testing a plurality of semiconductor devices carried upon a common substrate and in communication with common ground and power contacts, compnsing:
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magnetically drawing at least one of a first member of an electrical connector and at least one contact of a ground contact and a power contact toward the other of the first member and the at least one contact to establish and maintain a temporary electrical contact between the first member and the at least one contact; and permitting an electrical current to flow from at least one of the electrical connector and the contact to the other of the contact and the electrical connector as the temporary electrical contact is maintained. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification