Flip chip interconnection structure
First Claim
1. A method for forming a flip chip interconnection structure, comprisingproviding a first member on an IC chip and a second member on a substrate, the first member comprising a deformable material having a low yield strength and a high elongation to failure and the second member as provided having surface asperities on a surface on a part of the second member to be bonded with the first member;
- andbringing the first member into contact with the surface on the second member and pressing the first and second members against one another using a force sufficient to cause plastic flow of part of the first member into the surface asperities on the second member, whereby part of the first member undergoes plastic deformation into the asperities on the second member.
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Accused Products
Abstract
A flip chip interconnection structure is formed by mechanically interlocking joining surfaces of a first and second element. The first element, which may be a bump on an integrated circuit chip, includes a soft, deformable material with a low yield strength and high elongation to failure. The surface of the second element, which may for example be a substrate pad, is provided with asperities into which the first element deforms plastically under pressure to form the mechanical interlock.
115 Citations
23 Claims
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1. A method for forming a flip chip interconnection structure, comprising
providing a first member on an IC chip and a second member on a substrate, the first member comprising a deformable material having a low yield strength and a high elongation to failure and the second member as provided having surface asperities on a surface on a part of the second member to be bonded with the first member; - and
bringing the first member into contact with the surface on the second member and pressing the first and second members against one another using a force sufficient to cause plastic flow of part of the first member into the surface asperities on the second member, whereby part of the first member undergoes plastic deformation into the asperities on the second member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for forming a flip chip interconnection structure, comprising
providing a first member on an IC chip and a second member on a substrate, the first member comprising a deformable material having a low yield strength and a high elongation to failure and the second member as provided having a surface adjacent an edge on a part of the second member to be bonded with the first member; - and
bringing the first member into contact with the second member surface and pressing the first and second members against one another using a force sufficient to cause plastic flow of part of the first member around the edge, whereby part of the first member undergoes plastic. deformation round the edge. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification