Information processing device

• US 7,035,108 B2
• Filed: 10/08/2004
• Issued: 04/25/2006
• Est. Priority Date: 05/20/1992
• Status: Expired due to Fees

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Wakabayashi, Kenichi, Takayama, Chitoshi, Shiozaki, Tadashi
• Primary Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US10/962,364
• Publication Number:
  US 20050047096A1
• Time in Patent Office: 564 Days
• Field of Search: 361/687, 361/690, 361/692, 361702-712, 361714-719, 361/732, 361/737, 361/753, 361/761, 361/816, 361/818, 361/694, 361726-727, 257/718, 257/719, 257/726, 257/727, 365/52, 365/63, 165/80.3, 165/80.4, 165/165, 165/185, 235/380, 235/441, 235/492, 174/35.R, 174/51
• US Class Current: 361/719
• CPC Class Codes: B41J 29/377 Cooling or ventilating arrangements
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07735 the record carrier comprising means for protecting against electrostatic discharge
• CPC Class Codes: G06K 19/07741 comprising a first part operating as a regular record carrier and a second attachable part that changes the functional appearance of said record carrier, e.g. a contact-based smart card with an adapter part which, when attached to the contact card makes the contact card function as a non-contact card
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H05K 5/0208 Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
• CPC Class Codes: H05K 5/0256 of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

An information processing device is disclosed. The information processing device includes a heal dissipation plate structure including a thermally conductive material, and a processor including a major surface. A heat dissipating material is between and couples the processor and the heat dissipation plate structure. An array of pins is substantially perpendicular to the major surface of the processor. The device also includes a substrate including a plurality of holes, where the pins in the array of pins are configured to be inserted into the holes in the substrate.

Claims

1. An information processing device comprising:

a heat conductive element;

a processor in thermal communication with said heat conductive element, wherein said processor generates beat when energized, and wherein said heat conductive element dissipates heat generated by said processor;

a circuit board comprising a mounting area, wherein said processor is mounted and said mounting area;

a heat dissipating material between the heat conductive element and the processor, wherein the heat dissipating material directly contacts the heat conductive element and the processor; and

an insertion plug including an electrical contact formed at an end region of the circuit board, and

further comprising a biasing element adapted to push the circuit board towards the heat conductive element.

2. The information processing device of claim 1 wherein the heat conductive element is a plate.

3. The information processing device of claim 1 wherein the heat dissipating material has a heat conductance rate of 1 W/m·

K or more.

4. The information processing device of claim 1 wherein the heat dissipating material is formed from a non-solid material.

5. The information processing device of claim 1 wherein the heat conductive element comprises aluminum.

6. The information processing device of claim 1 wherein the heat dissipating material comprises silicon rubber.

7. The information processing device of claim 1 wherein the information processing device is in the form of a cartridge.

8. The information processing device of claim 1 wherein the circuit board is a printed circuit board.

9. The information processing device of claim 1 further comprising a housing configured to protect the processor.

10. The information processing device of claim 1 wherein the heat conductive clement is in the form of a plate, and wherein the information processing device further comprises a plurality of pins coupled to the processor.

11. An information processing device comprising:

a heat dissipation plate structure comprising a thermally conductive material, wherein the heat dissipation plate structure has a major portion and a perpendicular portion substantially perpendicular to the major portion;

a processor comprising a major surface, wherein said processor generates heat when energized, wherein the heat dissipation plate structure is adapted to dissipate heat from th processor, and wherein the perpendicular portion of the heat dissipation plate structure faces a side of the processor;

a heat dissipating material contacting the processor and the major portion of the heat dissipation plate structure, without contacting the perpendicular portion of the heat dissipation plate structure; and

an array of pins, wherein the pins in the array of pins are substantially perpendicular to and under the major surface of the processor, and wherein the pins are adapted to be received in a socket assembly mounted on a circuit board.

12. The information processing device of claim 11 further comprising a biasing element operatively coupled to the processor.

13. The information processing device of claim 11 wherein the processor is a microprocessor.

14. The information processing device of claim 11 wherein a structure comprising four walls is disposed around the processor.

15. The information processing device of claim 11 wherein the heat dissipating material is formed from a non-solid material having a viscous liquid putty, or grease-like state.

16. The information processing device of claim 11 wherein the heat dissipation plate structure comprises aluminum.

17. The information processing device of claim 11 wherein the beat dissipation plate structure and the processor are directly connected through the heat dissipating material.

18. The information processing device of claim 11 wherein the heat dissipating material comprises silicone rubber.

19. The information processing device of claim 11 wherein the heat dissipating material has a thermal conductance rate of 1 W/m·

K or more.

20. The information processing device of claim 11 wherein the processor is a RISC type microprocessor.

21. The information processing device of claim 11 further comprising a conductive structure mechanically coupled to the processor, wherein the conductive structure forms an electromagnetic shield for the processor.

22. The information processing device of claim 11 further comprising a conductive structure mechanically coupled to the processor, wherein the conductive structure forms an electromagnetic shield for the processor, and wherein the conductive structure surrounds four sides of the processor.

23. The information processing device of claim 11 further comprising a conductive structure mechanically coupled to the processor, wherein the conductive structure forms an electromagnetic shield for the processor, and wherein the conductive structure is grounded to a printed circuit board.

24. The information processing device of claim 11 wherein the processor has an operating clock speed of at least 25 MHz.

25. An information processing device comprising:

a heat dissipation plate structure comprising a thermally conductive material;

a processor comprising a major surface, wherein said processor generates heat when energized, and wherein the heat dissipation plate structure is adapted to dissipate heat from the processor;

a heat dissipating material contacting the processor and the heat dissipation plate structure;

an array of pins, wherein the pins in the array of pins are substantially perpendicular to the major suffice of the processor;

a socket assembly; and

a circuit board, wherein the socket assembly is on the circuit board,

wherein the pins in the array of pins are configured to be received in the socket assembly.

26. The information processing device of claim 25 further comprising a biasing element operatively coupled to the processor.

27. The information processing device of claim 25 wherein the processor is a microprocessor.

28. The information processing device of claim 25 wherein a structure comprising four walls is disposed around the processor.

29. The information processing device of claim 25 wherein the heat dissipating material is formed from a non-solid material having a viscous liquid, putty, or grease-like state.

30. The information processing device of claim 25 wherein the heat dissipation plate structure comprises aluminum.

31. The information processing device of claim 25 wherein the heat dissipation plate structure and the processor are directly connected through the heat dissipating material.

32. The information processing device of claim 25 wherein the heat dissipating material comprises silicone rubber.

33. The information processing device of claim 25 wherein the heat dissipating material has a thermal conductance rate of 1 W/m·

K or more.

34. The information processing device of claim 25 wherein the processor is a RISC type microprocessor.

35. The information processing device of claim 25 further comprising a conductive structure mechanically coupled to the processor, and wherein the conductive structure forms an electromagnetic shield for the processor.

36. The information processing device of claim 25 further comprising a conductive structure mechanically coupled to the processor, wherein the conductive structure forms an electromagnetic shield for the processor, and wherein the conductive structure surrounds four sides of the processor.

37. The information processing device of claim 25 further comprising a conductive structure mechanically coupled to the processor, wherein the conductive structure forms an electromagnetic shield for the processor, and wherein the conductive structure is grounded to a printed circuit board.