Integrated circuits with at least one layer that has more than one preferred interconnect direction, and method for manufacturing such IC's
First Claim
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1. An integrated circuit (“
- IC”
) having a design based on a layout, said layout defined by using a wiring model that allows at least a particular wiring layer of the IC to have at least two preferred interconnect directions in at least a region of the particular wiring layer, wherein in no part of the region on the particular layer are routes in either of the two preferred interconnect directions assessed a non-preferred direction routing penalty that results in one of the two preferred interconnect directions being more preferable than the other preferred interconnect direction.
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Abstract
Some embodiments of the invention provide an integrated-circuit chip that has a design based on a wiring model that allows at least a particular wiring layer to have more than one preferred wiring directions. Other embodiments provide a method of manufacturing an integrated circuit (“IC”) that has a plurality of wiring layers. The method specifies a layout of the IC by using a wiring model that specifies more than one preferred wiring direction for at least a region of a particular wiring layer. The method then uses the layout to fabricate the integrated circuit.
149 Citations
21 Claims
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1. An integrated circuit (“
- IC”
) having a design based on a layout, said layout defined by using a wiring model that allows at least a particular wiring layer of the IC to have at least two preferred interconnect directions in at least a region of the particular wiring layer, wherein in no part of the region on the particular layer are routes in either of the two preferred interconnect directions assessed a non-preferred direction routing penalty that results in one of the two preferred interconnect directions being more preferable than the other preferred interconnect direction. - View Dependent Claims (2, 3, 4)
- IC”
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5. An integrated circuit (“
- IC”
) having a design based on a wiring model that allows at least a particular wiring layer of the IC to have more than one preferred wiring direction in at least a region of the particular wiring layer, wherein a plurality of interconnect wires are on the particular layer, wherein at most 70% of the interconnect wires on the particular layer are in the same preferred direction. - View Dependent Claims (6, 7, 8, 9, 10)
- IC”
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11. A method of manufacturing an integrated circuit, the integrated circuit having a plurality of wiring layers, the method comprising:
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a) specifying a layout of the integrated circuit by using a wiring model that specifies at least two preferred interconnect directions for at least a region of a particular wiring layer, wherein in no part of the region on the particular layer are routes in either of the two preferred interconnect directions assessed a non-preferred direction routing penalty that results in one of the two preferred interconnect directions being more preferable than the other preferred interconnect direction; b) using the layout to fabricate the integrated circuit. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A method of manufacturing an integrated circuit, the integrated circuit having a plurality of wiring layers, the method comprising:
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a) specifying a layout of the integrated circuit by using a wiring model that specifies more than one preferred wiring direction for at least a region of a particular wiring layer, wherein a plurality of interconnect wires are on the particular layer, wherein at most 70% of the interconnect wires on the particular layer are in the same preferred direction, b) using the layout to fabricate the integrated circuit. - View Dependent Claims (19, 20, 21)
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Specification