Pin-deposition of conductive inks for microelectrodes and contact via filling
First Claim
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1. A method of metalization in an integrated microsystem, comprising the steps of:
- providing a poly(dimethylsiloxane) substrate,forming at least one conducting line in said poly(dimethylsiloxane) substrate,forming at least one hole in said poly(dimethylsiloxane) substrate with said hole connected to said at least one conducting line, and applying a conductive material to said at least one hole in said poly(dimethylsiloxane) substrate by taking up at least one aliquot of conductive material and releasing said conductive material into said at least one hole in said poly(dimethylsiloxane) substrate to produce a circuit component.
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Abstract
A method of metalization of an integrated microsystem. The method comprises providing a substrate and applying a conductive material to the substrate by taking up small aliquots of conductive material and releasing the conductive material onto the substrate to produce a circuit component.
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Citations
18 Claims
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1. A method of metalization in an integrated microsystem, comprising the steps of:
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providing a poly(dimethylsiloxane) substrate, forming at least one conducting line in said poly(dimethylsiloxane) substrate, forming at least one hole in said poly(dimethylsiloxane) substrate with said hole connected to said at least one conducting line, and applying a conductive material to said at least one hole in said poly(dimethylsiloxane) substrate by taking up at least one aliquot of conductive material and releasing said conductive material into said at least one hole in said poly(dimethylsiloxane) substrate to produce a circuit component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of metalization in an integrated polymer microsystem, comprising the steps of:
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providing a flexible poly(dimethylsiloxane) substrate, forming at least one conducting line in said flexible poly(dimethylsiloxane) substrate, forming at least one hole in said flexible poly(dimethylsiloxane) substrate with said hole connected to said at least one conducting line, and applying a conductive material to said at least one hole in said flexible poly(dimethylsiloxane) substrate by taking up at least one aliquot of conductive material and releasing said conductive material into said at least one hole in said flexible poly(dimethylsiloxane) substrate to produce a circuit component. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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Specification