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Chip package structure with glass substrate

  • US 7,038,309 B2
  • Filed: 08/15/2003
  • Issued: 05/02/2006
  • Est. Priority Date: 09/09/2002
  • Status: Active Grant
First Claim
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1. A chip package structure, comprising:

  • a glass substrate having a substrate surface;

    a circuit layer on said substrate surface, wherein said circuit layer includes a plurality of first bonding pads and a plurality of second bonding pads on a surface of said circuit layer;

    at least a die having an active surface and a back side, wherein said die includes a plurality of die pads on said active surface;

    a plurality of bumps, wherein each of said bumps connects one of said die pads with one of said first bonding pads;

    a plurality of contacts disposed on said second bonding pads; and

    at least a passive device inside said circuit layer.

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