Chip package structure with glass substrate
First Claim
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1. A chip package structure, comprising:
- a glass substrate having a substrate surface;
a circuit layer on said substrate surface, wherein said circuit layer includes a plurality of first bonding pads and a plurality of second bonding pads on a surface of said circuit layer;
at least a die having an active surface and a back side, wherein said die includes a plurality of die pads on said active surface;
a plurality of bumps, wherein each of said bumps connects one of said die pads with one of said first bonding pads;
a plurality of contacts disposed on said second bonding pads; and
at least a passive device inside said circuit layer.
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Abstract
The present invention provides a chip package structure, comprising: a glass substrate having a substrate surface; a circuit layer on the substrate surface, wherein the circuit layer comprises an interconnection structure; at least a die on the circuit layer, wherein the die is coupled to the interconnection structure; and a plurality of contacts on the circuit layer, wherein the contacts are coupled to the interconnection structure.
30 Citations
20 Claims
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1. A chip package structure, comprising:
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a glass substrate having a substrate surface; a circuit layer on said substrate surface, wherein said circuit layer includes a plurality of first bonding pads and a plurality of second bonding pads on a surface of said circuit layer; at least a die having an active surface and a back side, wherein said die includes a plurality of die pads on said active surface; a plurality of bumps, wherein each of said bumps connects one of said die pads with one of said first bonding pads; a plurality of contacts disposed on said second bonding pads; and at least a passive device inside said circuit layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A chip package structure, comprising
a glass substrate having a substrate surface; -
a circuit layer on said substrate surface, wherein said circuit layer includes a plurality of first bonding pads and a plurality of second bonding pads on the surface of said circuit layer; at least a die having an active surface and a back side, wherein said back side of said die is set on said circuit layer and said die includes a plurality of die pads on said active surface; a plurality of conducting wires, wherein each of said conducting wire connects one of said die pads with one of said first bonding pads; and a plurality of contacts disposed on said second bonding pads. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification