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System and method for removing heat from a subscriber optical interface

  • US 7,038,910 B1
  • Filed: 01/07/2003
  • Issued: 05/02/2006
  • Est. Priority Date: 01/07/2002
  • Status: Expired due to Term
First Claim
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1. A heat removal system comprising:

  • a housing comprising an opening;

    a plate positioned over the opening;

    a standoff positioned on a side of the housing adjacent to the opening and extending in a direction away from the housing;

    a printed circuit board and a heat producing element disposed on the printed circuit board;

    heat conductive material positioned between the heat producing element and the plate; and

    projections extending from the plate and extending in the same direction as the standoff, whereby the projections transfer heat away from an interior of the housing.

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