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Electrooptic assembly

  • US 7,039,263 B2
  • Filed: 09/24/2002
  • Issued: 05/02/2006
  • Est. Priority Date: 09/24/2002
  • Status: Expired due to Fees
First Claim
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1. An electrooptic assembly, comprising:

  • a microelectronic package having an active side, wherein said microelectronic package includes a core having an opening in which a microelectronic die is adhered by an encapsulation material;

    a build-up layer on the active side of the microelectronic package and including a conductive trace;

    an optical substrate;

    an electrooptic element coupled to said build-up layer to convert and transmit a signal from one of said microelectronic package and said optical substrate to the other of said microelectronic package and said optical substrate; and

    a bonding agent bonding said optical substrate to said build-up layer.

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