Conductance path mechanism for wireless heartbeat transmitter

• US 7,039,456 B2
• Filed: 01/31/2003
• Issued: 05/02/2006
• Est. Priority Date: 01/31/2003
• Status: Expired due to Fees

• Current Assignee: Direction Technology Co., Ltd.
• Original Assignee: Direction Technology Co., Ltd.
• Inventors: Chen, Shui Jung
• Primary Examiner(s): Bockelman, Mark
• Assistant Examiner(s): Bertram, Eric
• Application Number:
  US10/354,962
• Publication Number:
  US 20040171951A1
• Time in Patent Office: 1,187 Days
• Field of Search: 600/509, 600/386, 439/909, 607/37
• US Class Current: 600/509
• CPC Class Codes: A61B 5/0006 ECG or EEG signals
• CPC Class Codes: A61B 5/276 Protection against electrode failure
• CPC Class Codes: Y10S 439/909 Medical use or attached to human body

Abstract

This invention relates to a conductance path mechanism of a wireless heartbeat transmitter comprising a circuit board, a spiral spring, a U-shaped contact rod integrally molded to both side of a bottom cover and a rubber conductible sheet. A horizontal portion of said U-shaped contact rod is totally inserted inside a foundation of a bottom cover to form a steady mechanism of the present invention.

Claims

1. A conductance path mechanism of a wireless heartbeat transmitter comprising an upper cover, a bottom cover provided with a front wall rib and a rear wall rib, a circuit board, two spiral springs, two U-shaped contact rods integrally molded on both left and right sides of said bottom cover, two fixing bands, two rubber conductible sheets and two pressing plate;

and wherein said bottom cover further comprising a left wall rib and a right wall rib for connecting and strengthening said front wall rib and said rear wall rib, and two rib walls positioned around a contact positioning pin and located on both sides of a central district of said bottom cover to form a spring detent groove.

2. The conductance path mechanism according to claim 1, wherein said U-shaped contact rod has one horizontal portion totally inserted inside a foundation of said bottom cover, and has two vertical ends;

and wherein one said vertical end is provided with three upward vertical pins protruding out of the foundation of said bottom cover and inserted into a rubber conductible sheet at the bottom of a fixing band to form a conductible, insert-connecting mechanism and the other vertical end of said U-shaped contact rods forms a contact positioning pin, which extend within said spring dent groove and places spiral springs on both sides of the bottom of said circuit board inside a collar of said contact positioning pin.

3. The conductance path mechanism according to claim 2, wherein lower sections of said spiral spring is tightly inserted inside said spring detent groove to make said spiral spring and said bottom cover form a tight and steady mechanism, and to make said spiral spring and said contact positioning pin form a superior electrical contact and an excellent conductance path.

4. The conductance path mechanism according to claim 3, further comprising a pressing plate sheet positioned at a front end surface of each fixing band to make said three upward vertical pins of said U-shaped contact rod completely inserted into the interior of said rubber conductible sheet.