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Sealing lighting device component assembly with solder glass preform by using infrared radiation

  • US 7,040,121 B2
  • Filed: 10/31/2002
  • Issued: 05/09/2006
  • Est. Priority Date: 10/31/2002
  • Status: Expired due to Fees
First Claim
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1. A process for hermetically sealing a component to a lamp envelope of a lighting device made of glass having a CTE C1 from 0 to 300°

  • C., comprising the following steps;

    (i) providing a component assembly comprising the component to be sealed with the lamp envelope and an infrared absorbing solder glass preform enclosing and bonded to the portion of the component to be hermetically sealed and affixed to the glass lamp envelope, wherein solder glass of the preform has a before-sealing softening point Ts over 500°

    C., an after-sealing CTE C2 from 0 to 300°

    C. in the range of C1±

    10×

    10

    7
    °

    C.

    1
    , and is capable of forming a hermetic sealing of the component with the lamp envelope upon being heated to a temperature over its before-sealing softening point;

    (ii) attaching the component assembly to a hole of the lamp envelope through which the component is to be sealed and affixed to the lamp envelope; and

    (iii) heating the solder glass preform locally using infrared radiation to a temperature higher than the before-sealing softening point Ts of the solder glass to effect a hermetic sealing,wherein the solder glass preform is formed from a devitrifying solder glass consisting essentially of a B2O3

    SiO2

    PbO—

    ZnO glass containing CuO and/or Fe2O3, having a before-sealing softening point in the range of 550–

    700°

    C., an after-sealing CTE C2 from 0 to 300°

    C. in the range of 32–

    40×

    10

    7
    °

    C.

    1
    and a devitrifying temperature Td in the range of 630–

    750°

    C.

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