Polishing apparatus
First Claim
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1. A method for dressing a polishing cloth provided in a polishing apparatus, comprising:
- initially conditioning a polishing cloth, before use in a polishing process, by using a first dressing unit including a diamond dresser or an SiC dresser; and
conditioning said polishing cloth, between processes of polishing a workpiece, by using a second dressing unit including a brush dresser,wherein said second dressing unit is not used during the initial conditioning of said polishing cloth.
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Abstract
The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the polishing surface, which is a surface of a polishing cloth.
34 Citations
12 Claims
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1. A method for dressing a polishing cloth provided in a polishing apparatus, comprising:
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initially conditioning a polishing cloth, before use in a polishing process, by using a first dressing unit including a diamond dresser or an SiC dresser; and conditioning said polishing cloth, between processes of polishing a workpiece, by using a second dressing unit including a brush dresser, wherein said second dressing unit is not used during the initial conditioning of said polishing cloth. - View Dependent Claims (4)
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2. A method for dressing a polishing cloth provided in a polishing apparatus, comprising:
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initially conditioning a polishing cloth, before use in a polishing process, by using a first dressing unit including a diamond dresser or an SiC dresser; and between processes of polishing a workpiece, initially conditioning said polishing cloth by using said first dressing unit including said diamond dresser or said SiC dresser, and then conditioning said polishing cloth by using a second dressing unit including a brush dresser, wherein said second dressing unit is not used during the initial conditioning of said polishing cloth. - View Dependent Claims (5)
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3. A method for dressing a polishing cloth provided in a polishing apparatus, comprising:
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while polishing a workpiece, performing dressing of a polishing cloth while swinging a first dresser having a diameter smaller than a diameter of said workpiece; and
thenafter polishing said workpiece, performing dressing of said polishing cloth by using a second dresser having a diameter larger than said diameter of said workpiece. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12)
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Specification