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Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems

  • US 7,041,172 B2
  • Filed: 02/20/2003
  • Issued: 05/09/2006
  • Est. Priority Date: 02/20/2003
  • Status: Active Grant
First Claim
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1. A multi-syringe fluid dispensing system for semiconductor substrate processing comprising:

  • a wafer track coating module containing a spin chuck that is positioned within a catch cup;

    a solution tray located within the wafer track coating module for holding a plurality of fluid syringes containing semiconductor substrate processing solutions; and

    a dispense arm and gripper assembly for gripping and positioning a fluid syringe within the wafer track coating module, the gripper including a plunger holder and a syringe body holder for engaging a selected syringe from the solution tray.

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