Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems
First Claim
1. A multi-syringe fluid dispensing system for semiconductor substrate processing comprising:
- a wafer track coating module containing a spin chuck that is positioned within a catch cup;
a solution tray located within the wafer track coating module for holding a plurality of fluid syringes containing semiconductor substrate processing solutions; and
a dispense arm and gripper assembly for gripping and positioning a fluid syringe within the wafer track coating module, the gripper including a plunger holder and a syringe body holder for engaging a selected syringe from the solution tray.
1 Assignment
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Accused Products
Abstract
Methods and apparatus for controllably dispensing photoresist solutions and other fluids in semiconductor manufacturing equipment from an array of syringe-based fluid dispensers. A multi-syringe fluid dispensing system is provided for photoresist coating within a wafer track coating module. The coating module may contain a spin chuck that is positioned within a catch cup. A robotic dispense arm and gripper assembly may be positioned within the coating module for gripping and positioning a fluid syringe. An array of syringes may be stored on a solution tray within the wafer track coating module for holding a plurality of fluid syringes containing photoresist solutions.
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Citations
7 Claims
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1. A multi-syringe fluid dispensing system for semiconductor substrate processing comprising:
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a wafer track coating module containing a spin chuck that is positioned within a catch cup; a solution tray located within the wafer track coating module for holding a plurality of fluid syringes containing semiconductor substrate processing solutions; and a dispense arm and gripper assembly for gripping and positioning a fluid syringe within the wafer track coating module, the gripper including a plunger holder and a syringe body holder for engaging a selected syringe from the solution tray. - View Dependent Claims (2)
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3. An apparatus for dispensing a plurality of semiconductor substrate processing solutions comprising:
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an array of fluid dispensers mounted on a tray within a processing module, wherein each fluid dispenser includes a nozzle portion formed at a relatively distal region of the fluid dispenser, a fluid line running along a length of the fluid dispenser leading to the nozzle portion, and a thermal jacket surrounding each fluid line for circulating a heat transfer medium and individually controlling the temperature of fluid within each fluid line; a dispense arm for supporting a mounted gripper that is configured to grip a selected nozzle portion of a selected fluid dispenser, and wherein the dispense arm can direct the selected nozzle portion to a predetermined location within the processing module; a fluid syringe pump assembly fluidly connected to a photoresist solution source and the fluid line of the selected fluid dispenser; and a controller for controlling the fluid syringe pump assembly and the dispense of fluid from the photoresist solution source through the selected nozzle portion of the selected fluid dispenser. - View Dependent Claims (4, 5, 6, 7)
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Specification