Methods for improving flow through fluidic channels
First Claim
1. A method for improving fluidic flow for a microfluidic device having a through hole or slot therein, the method comprising the steps of:
- forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least part of the thickness of the substrate; and
removing substantially all of the etch stop layer coating from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.
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Accused Products
Abstract
A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.
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Citations
24 Claims
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1. A method for improving fluidic flow for a microfluidic device having a through hole or slot therein, the method comprising the steps of:
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forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least part of the thickness of the substrate; and removing substantially all of the etch stop layer coating from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method for making a micro-fluid ejecting device comprising the steps of:
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providing a semiconductor substrate having a thickness ranging from about 400 to about 900 microns and having a first surface and a second surface opposite the first surface; micromachining one or more fluid flow openings through the semiconductor substrate for fluid flow communication from the second surface to the first surface of the substrate, the one or more fluid flow openings including side wall surfaces having a first water contact angle greater than ninety degrees; treating the one or more fluid flow openings to provide one or more fluid flow openings having a second water contact angle less than ninety degrees; and attaching a nozzle plate to the semiconductor substrate to provide the micro-fluid ejecting device. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24)
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Specification