Semiconductor package with integrated heat spreader attached to a thermally conductive substrate core

• US 7,042,084 B2
• Filed: 01/02/2002
• Issued: 05/09/2006
• Est. Priority Date: 01/02/2002
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Takeuchi, Timothy M.
• Primary Examiner(s): Owens, Douglas W
• Application Number:
  US10/038,806
• Publication Number:
  US 20030122242A1
• Time in Patent Office: 1,588 Days
• Field of Search: 257/690, 257/691, 257/697, 257704-707, 257717-720, 257778-780, 257/796, 257/710, 257/675, 438122-127
• US Class Current: 257/706
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/051 another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/1616 Cavity shape
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A semiconductor package substrate has top and bottom surface buildup layers disposed on a thermally conductive substrate core. A portion of the substrate core may be exposed at a top surface of the package substrate to allow a heat spreader to be thermally coupled to the substrate core. An integrated circuit may be mounted on a top surface of the package substrate, with a top surface of the integrated circuit facing down. A heat spreader may be attached to the package substrate. The heat spreader may be thermally coupled to the substrate core and to a backside surface of the integrated circuit.

Claims

1. An apparatus comprising:

a package substrate including a thermally conductive substrate core, having first and second portions, and a buildup layer, including a plurality of conductive traces and vias formed therein interconnecting top and bottom surfaces of the buildup layer, being disposed on only the first portion of the substrate core;

an integrated circuit having a top surface and a backside surface, the integrated circuit mounted to the buildup layer with the top surface of the integrated circuit facing the package substrate; and

a heat spreader mounted to the second portion of the substrate core, a bottom surface of the heat spreader thermally coupled to the backside surface of the integrated circuit.

2. The apparatus of claim 1, wherein the heat spreader is thermally coupled to a perimeter portion of the substrate core.

3. The apparatus of claim 1, wherein the heat spreader is soldered to the substrate core.

4. The apparatus of claim 1, wherein the substrate core and the heat spreader are electrically conductive and electrically connected, the substrate core and the heat spreader jointly forming an electrically conductive enclosure to shield the integrated circuit from electromagnetic interference.

5. The apparatus of claim 4, wherein the substrate core and the heat spreader are made of metal.

6. The apparatus of claim 1, comprising a thermal interface material disposed between the backside surface of the integrated circuit and the bottom surface of the heat spreader.

7. The apparatus of claim 1, comprising a heat sink attached to a top surface of the heat spreader.

8. The apparatus of claim 7, comprising a fan attached to the heat sink.

9. The apparatus of claim 1, wherein the integrated circuit is mechanically and electrically coupled to the package substrate by a plurality of solder bump interconnections.

10. The apparatus of claim 9, comprising a printed circuit board, wherein the package substrate is mounted on the printed circuit board.

11. The apparatus of claim 10, wherein the package substrate is mechanically and electrically coupled to the printed circuit board by a plurality of solder bump interconnections.

12. An apparatus comprising:

a package substrate including a thermally conductive substrate core, having first and second portions, and a buildup layer, including a plurality of conductive traces and vias formed therein interconnecting top and bottom surfaces of the buildup layer, being disposed on only the first portion of the substrate core;

at least two integrated circuits having top surfaces and a backside surface, the integrated circuits mounted to the package substrate with the top surfaces of the integrated circuits facing the package substrate; and

a heat spreader mounted to the second portion of the substrate core, wherein a surface of the heat spreader is thermally connected to the backside surfaces of the at least two integrated circuits.

13. The apparatus of claim 12, comprising one or more capacitors mounted on a top surface of the package substrate.

14. The apparatus of claim 12, wherein the substrate core and the heat spreader are electrically conductive and electrically connected, the substrate core and the heat spreader jointly forming an electrically conductive enclosure to shield the integrated circuits from electromagnetic interference.

15. An apparatus comprising:

a package substrate including a metal substrate core, having first and second portions, and a buildup layer, having a plurality of conductive traces and vias formed therein interconnecting top and bottom surfaces of the buildup layer disposed on the first portion of the substrate core;

an integrated circuit having a top surface and a backside surface, the integrated circuit mounted to the buildup layer with the top surface of the integrated circuit facing the package substrate; and

a heat spreader mounted to the second portion of the substrate core, a bottom surface of the heat spreader thermally coupled to the backside surface of the integrated circuit.

16. The apparatus of claim 15, wherein the heat spreader is thermally coupled to a perimeter portion of the substrate core.

17. The apparatus of claim 16, comprising a heat sink attached to a top surface of the heat spreader.

18. The apparatus of claim 15, wherein the heat spreader is metal and is electrically connected to the substrate core.

19. The apparatus of claim 18, wherein the heat spreader and the substrate core jointly form an electrically conductive enclosure to shield the integrated circuit from electromagnetic interference.

20. An apparatus comprising:

a printed circuit board;

a package substrate mounted to the printed circuit board, the package substrate including a thermally conductive substrate core, having first and second portions, and a buildup layer, including a plurality of conductive traces and vias formed therein interconnecting top and bottom surfaces of the package substrate layer, being disposed on only the first portion of the substrate core;

an integrated circuit having a top surface and a backside surface, the integrated circuit mounted to the buildup layer with the top surface of the integrated circuit facing the package substrate, the integrated circuit being electrically connected to the printed circuit board through the conductive traces and vias of the package substrate; and

a heat spreader mounted to the second portion of the substrate core, a bottom surface of the heat spreader thermally coupled to the backside surface of the integrated circuit.

21. The apparatus of claim 20, wherein the heat spreader is thermally coupled to a perimeter portion of the substrate core.

22. The apparatus of claim 21, wherein the heat spreader is soldered to the substrate core.

23. The apparatus of claim 22, wherein the substrate core and the heat spreader are electrically conductive and electrically connected, the substrate core and the heat spreader jointly forming an electrically conductive enclosure to shield the integrated circuit from electromagnetic interference.