Bonding pad for a packaged integrated circuit

• US 7,042,098 B2
• Filed: 07/07/2003
• Issued: 05/09/2006
• Est. Priority Date: 07/07/2003
• Status: Expired due to Fees

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Harun, Fuaida, Koh, Liang Jen, Tan, Lan Chu
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US10/613,703
• Publication Number:
  US 20050006734A1
• Time in Patent Office: 1,037 Days
• Field of Search: 257/774, 257/668, 257700-703, 257/758, 257/698, 257690-693, 257/784, 257/786, 257/780, 257/781, 257/773, 361/767, 361/768, 361/262, 361/782, 361/719, 174/252, 174/259, 174/255, 174/266, 298/46
• US Class Current: 257/774
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45164 Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48235 connecting the wire to a via metallisation of the item
• CPC Class Codes: H01L 2224/4917 Crossed wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/78 : Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base

Abstract

An integrated circuit is packaged using a package substrate that has a bottom side with a regular array of connection points and a top side with the integrated circuit on it. Vias in the package substrate provide electrical connection between the top and bottom sides. The vias have a via capture pad to which a wire may be wire bonded so that the wires from the IC to the substrate top side directly contact the vias at their capture pads without the need for traces from a top side bond pad to a via. The via capture pad is shaped to include at least one sharp edge to improve the ability of a wirebonder with pattern recognition software to locate the capture pad and place the wire.

Claims

1. A bonding pad electrically coupled to a via that extends from one side of a substrate to an opposing side of a substrate, the bonding pad comprising:

a photo mask area;

a clearance area located within the photo mask area;

a land area, located within the clearance area, for receiving at least one insulated bond wire, and wherein at least one of the photo mask area, the clearance area and the land area has at least one sharp edge that assists a pattern recognition system of a wire bonder in locating the at least one bond wire on the land area, and wherein the photo mask area, the clearance area and the land area surround the via; and

a plug located within the via, wherein the at least one insulated bond wire is electrically coupled to the via.

2. The bonding pad of claim 1, wherein the clearance area comprises BT.

3. The bonding pad of claim 1, wherein the land area comprises a conductive metal.

4. The bonding pad of claim 3, wherein the conductive metal comprises at least one of copper, gold, silver and aluminum.

5. The bonding pad of claim 1, wherein the photo mask area and the clearance area are generally rectangular.

6. The bonding pad of claim 5, wherein the land area is generally rectangular.

7. The bonding pad of claim 6, wherein the land area has a plurality of sharp edges that assist the pattern recognition system of the wire bonder in locating the land area and attaching the at least one bond wire thereto.

8. The bonding pad of claim 7, wherein the land area has one or more cut outs on each side that are perpendicular to the side and extend toward the via.

9. The bonding pad of claim 1, further comprising a solder mask area located within the land area and surrounding the via plug.

10. A bonding pad electrically coupled to a via that extends from one side of a substrate to an opposing side of a substrate, the bonding pad comprising:

a photo mask area surrounding the via;

a clearance area located within the photo mask area and surrounding the via;

a land area, located within the clearance area and surrounding the via, for receiving at least one bond wire, wherein at least one of the photo mask area, the clearance area and the land area has at least one sharp edge that assists a pattern recognition system of a wire bonder in locating the at least one bond wire on the land area.

11. The bonding pad of claim 10, wherein the clearance area comprises BT.

12. The bonding pad of claim 10, wherein the land area comprises a conductive metal.

13. The bonding pad of claim 12, wherein the conductive metal comprises at least one of copper, gold, silver and aluminum.

14. The bonding pad of claim 10, wherein the photo mask area and the clearance area are generally rectangular.

15. The bonding pad of claim 14, wherein the land area is generally rectangular.

16. The bonding pad of claim 15, wherein the land area has a plurality of sharp edges.

17. The bonding pad of claim 16, wherein the land area has one or more cut outs on each side thereof that are perpendicular to the side and extend toward the via.

18. The bonding pad of claim 15, further comprising a solder mask area located within the land area and surrounding the via.