Energy conditioning circuit assembly

• US 7,042,303 B2
• Filed: 05/23/2003
• Issued: 05/09/2006
• Est. Priority Date: 04/07/1998
• Status: Expired due to Fees

• Current Assignee: X2Y Attenuators, LLC
• Original Assignee: X2Y Attenuators, LLC
• Inventors: Anthony, Anthony A., Anthony, William M.
• Primary Examiner(s): Lee, Benny
• Assistant Examiner(s): GLENN, KIMBERLY E
• Application Number:
  US10/443,778
• Publication Number:
  US 20040032304A1
• Time in Patent Office: 1,082 Days
• Field of Search: 333/182, 333/185, 333/12, 361/58, 361/113, 361/118
• US Class Current: 333/12
• CPC Class Codes: H01G 2/065 for surface mounting, e.g. chip capacitors
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01R 13/719 specially adapted for high frequency, e.g. with filters
• CPC Class Codes: H03H 1/0007 of radio frequency interference filters
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

The present invention is a component carrier (132) consisting of a plate of insulating material having a plurality of apertures (140) for accepting the leads of a thru-hole differential and common mode filter (130). Another embodiment consists of a surface mount component carrier (10) comprising a disk (16) of insulating material having a plurality of apertures (24). The same concept for the above described carrier is also incorporated into several alternate embodiments, either independently, embedded within electronic connectors. The overall configuration and electrical characteristics of the concepts underlying the present inventions are also described as an energy conditioning circuit assembly which encompasses the combination of differential and common mode filters and component carriers optimized for such filters. The various embodiments of component carriers provide increased physical support and protection to differential and common mode filters and substantially improve the electrical characteristics of the filters due to the increased shielding provided by the carriers. Embodiments of the carrier energy conditioning assembly include integrated circuit construction for a differential and common mode filter coupled to the power bus of an integrated circuit.

Claims

1. An electrode arrangement, comprising:

a first electrode band;

a second electrode band;

a third electrode band;

a fourth electrode band;

a fifth electrode band; and

a sixth electrode band;

wherein said first electrode band and said third electrode band are conductively coupled to one another;

wherein said second electrode band and said fourth electrode band are conductively coupled to one another;

wherein said fifth electrode band and said sixth electrode band are conductively coupled to one another;

wherein said first electrode band and said third electrode band are conductively isolated from said second electrode band and said fourth electrode band; and

wherein said first electrode band, said second electrode band, said third electrode band, and said fourth electrode band are conductively isolated from said fifth electrode band and said sixth electrode band.

2. A circuit comprising the electrode arrangement of claim 1, said circuit further comprising:

a source of energy;

an energy-utilizing load;

a first pathway operable as an energy source path from the source of energy of the circuit to the energy-utilizing load of the circuit; and

a second pathway operable as an energy return path from the energy-utilizing load of the circuit to the source of energy of the circuit.

3. The circuit of claim 2, wherein:

the first pathway is conductively coupled to said first electrode band and said third electrode band; and

the second pathway is conductively coupled to said second electrode band and said fourth electrode band.

4. The circuit of claim 3, further comprising a third pathway of said electrode arrangement operable as a voltage reference for said circuit.

5. The circuit of claim 2, further comprising a conductive area conductively coupled to said fifth electrode band and the sixth electrode band.

6. The circuit of claim 5, wherein said first pathway, said second pathway, and said conductive area are attached to a substrate.

7. The circuit of claim 6, wherein said substrate comprises a plurality of layers.

8. The circuit of claim 7, wherein:

said plurality of layers comprises a first layer and a second layer;

said first pathway and said second pathway are attached to said first layer; and

said conductive area is attached to said second.

9. The circuit of claim 7, wherein:

said plurality of layers comprises a first layer, a second layer, and a third layer;

said first pathway is attached to said first layer;

said second pathway is attached to said second layer; and

said conductive area is attached said third layer.

10. The circuit of claim 7, wherein said electrode arrangement is arranged within said substrate.

11. The circuit of claim 6 further comprising a printed circuit board including said substrate.

12. The circuit of claim 6 further comprising a connector including said substrate.

13. The circuit of claim 6 further comprising an integrated circuit package including said substrate.

14. The circuit of claim 2, wherein said first pathway and said second pathway are electrically separated from one another by a path including at least said load.

15. The circuit of claim 2 in which said circuit is energized.

16. The circuit of claim 2, wherein:

said first pathway extends from said energy source to said third electrode band; and

said first pathway extends from said first electrode band to said energy-utilizing load.

17. The circuit of claim 2, further comprising:

first pathway structure for selectively coupling such that, when coupled, said first pathway forms a conductive path from said energy source to said energy-utilizing load; and

second pathway structure for selectively coupling such that, when coupled, said second pathway forms a conductive pathway from said energy-utilizing load to said energy source.

18. The circuit of claim 2, wherein:

said first electrode plate is coupled to said first pathway in at least a pair of opposing locations,

said second electrode plate is coupled to said second pathway in at least a pair of opposing locations; and

said plurality of shielding electrode plates are coupled to said conductive area in at least a pair of opposing locations.

19. The circuit of claim 18, wherein said circuit is electrically coupled to an integrated circuit.

20. The circuit of claim 19, wherein said circuit is energized.

21. The electrode arrangement of claim 1, further comprising:

a plurality of shielding electrode plates comprising at least a first shielding electrode plate, a second shielding electrode plate, and a third shielding electrode plate;

a first electrode plate;

a second electrode plate; and

wherein said first shielding electrode plate, said second shielding electrode plate, and said third shielding electrode plate are conductively coupled to one another.

22. The electrode arrangement of claim 21, wherein:

said first electrode plate is positioned between said first shielding electrode plate and said second shielding electrode plate; and

wherein said second electrode plate is positioned between said second shielding electrode plate and said third shielding electrode plate.

23. The electrode arrangement of claim 22, wherein:

said first electrode plate is electrically coupled to said first electrode band and said third electrode band;

said second electrode plate is electrically coupled to said second electrode band and said fourth electrode band; and

said plurality of shielding electrode plates is electrically coupled to said fifth electrode band and said sixth electrode band.

24. The electrode arrangement of claims 22, further comprising a dielectric material, wherein said dielectric material is between at least one of the following pairs of electrode plates:

said first electrode plate and said first shielding electrode plate;

said first shielding electrode plate and said second electrode plate; and

said second electrode plate and said third shielding electrode plate.

25. The electrode arrangement of claim 24, wherein said dielectric material is selected from a group consisting of ferrite materials and varistor materials.

26. The electrode arrangement of claim 22, wherein said first shielding electrode plate, said second shielding electrode plate, and said third shielding electrode plate are of substantially the same size as one another.

27. The electrode arrangement of claim 22, wherein said first electrode plate and said second electrode plate are of substantially the same size as one another.

28. A circuit comprising the electrode arrangement of claim 22, said circuit further comprising:

a source of energy;

an energy-utilizing load;

a first pathway operable as an energy supply path from said source of energy to said energy-utilizing load; and

a second pathway operable as an energy return path from said energy-utilizing load to said source of energy.

29. The circuit of claim 28, wherein said electrode arrangement further comprises:

a seventh electrode band; and

an eighth electrode band.

30. The circuit of claim 29, further comprising a conductive area conductively coupled to said fifth electrode band and said sixth electrode band;

and

wherein said seventh electrode band and said eighth electrode band are each conductively coupled to said conductive area.

31. The circuit of claim 30, wherein said first electrode plate is coupled to said first electrode band and said third electrode band;

said second electrode plate is coupled to said second electrode band and said fourth electrode band;

said plurality of shielding electrode plates are coupled to said fifth electrode band, said sixth electrode band, said seventh electrode band, and said eighth electrode band; and

said first electrode band, said second electrode band, said third electrode band, and said fourth electrode band are conductively isolated from said seventh electrode band and said eighth electrode band.

32. The circuit of claim 31, wherein said first shielding electrode plate, said second shielding electrode plate, and said third shielding electrode plate are of substantially the same size as one another.

33. The circuit of claim 31, wherein said first electrode plate and said second electrode plate are of substantially the same size as one another.

34. The electrode arrangement claim 22, wherein said first electrode band is positioned directly opposite said third electrode band with respect to said electrode arrangement;

and wherein said second electrode band is positioned directly opposite said fourth electrode band with respect to said electrode arrangement.

35. The electrode arrangement claim 22, wherein:

said first electrode band is positioned diagonally to said third electrode band with respect to said electrode arrangement; and

said second electrode band is positioned diagonally to said fourth electrode band with respect to said electrode arrangement.

36. A method of making an electrode arrangement, comprising:

providing a first electrode band;

providing a second electrode band;

providing a third electrode band;

providing a fourth electrode band;

providing a fifth electrode band; and

providing a sixth electrode band;

wherein said first electrode band and said third electrode band are conductively coupled to one another;

wherein said second electrode band and said fourth electrode band are conductively coupled to one another;

wherein said fifth electrode band and said sixth electrode band are conductively coupled to one another;

wherein said first electrode band and said third electrode band are conductively isolated from said second electrode band and said fourth electrode band; and

wherein said first electrode band, said third electrode band, said second electrode band, and said fourth electrode band are conductively isolated from said fifth electrode band and said sixth electrode band.

37. The method of claim 36 further comprising:

providing a plurality of shielding electrode plates comprising at least a first shielding electrode plate, a second shielding electrode plate, and a third shielding electrode plate;

providing a first electrode plate and a second electrode plate;

wherein said first shielding electrode plate, said second shielding electrode plate, and said third shielding electrode plate are conductively coupled to one another.

38. A method of using an electrode arrangement, said electrode arrangement comprising:

a first electrode band;

a second electrode band;

a third electrode band;

a fourth electrode band;

a fifth electrode band; and

a sixth electrode band;

wherein said first electrode band and said third electrode band are conductively coupled to one another;

wherein said second electrode band and said fourth electrode band are conductively coupled to one another;

wherein said fifth electrode band and said sixth electrode band are conductively coupled to one another;

wherein said first electrode band and said third electrode band are conductively isolated from said second electrode band and said fourth electrode band; and

wherein said first electrode band, said second electrode band, said third electrode band, and said fourth electrode band are conductively isolated from said fifth electrode band and said sixth electrode band;

said method comprising;

connecting said electrode arrangement into a circuit.

39. The method of claim 38, wherein said connecting comprises connecting

a source of energy;

an energy-utilizing load;

a first pathway operable as an energy source path from said source of energy to said energy-utilizing load; and

a second pathway operable as an energy return path from said energy-utilizing load to said source of energy.