Three dimensional multimode and optical coupling devices
First Claim
1. An RF electrical coupling device, comprising:
- first and second substrates;
a substrate connection means that serves to structurally connect the first substrate to the second substrate; and
first and second electrically conductive microstrips and a first dielectric element disposed upon the first and second substrates such that each substrate carries at least one element selected from the group consisting of the first and second electrically conductive microstrips and the first dielectric element,wherein the first and second electically conductive microstrips interact to facilitate the transfer of energy between the microstrips and the first dielectric element alters frequency characteristics of the transfer of energy.
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Accused Products
Abstract
Three dimensional electronic and optical coupling devices that are capable of providing high speed coupling over a large frequency range while limiting the amount of space consumption in the communications network. An optical or electrical coupling device comprises a first substrate and a second substrate adjacent to the first substrate having one or more optical waveguides or microstrips formed thereon. The substrates will have disposed thereon conductive microstrips and/or dielectric elements. The one or more optical waveguides or microstrips formed on the first substrate correspond to at least one optical waveguides or microstrips formed on the second substrate so as to facilitate optical coupling between the corresponding waveguides. Precise spacing between the substrates and precise spacing between the optical waveguides or microstrips facilitate the requisite optical/RF coupling.
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Citations
62 Claims
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1. An RF electrical coupling device, comprising:
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first and second substrates; a substrate connection means that serves to structurally connect the first substrate to the second substrate; and first and second electrically conductive microstrips and a first dielectric element disposed upon the first and second substrates such that each substrate carries at least one element selected from the group consisting of the first and second electrically conductive microstrips and the first dielectric element, wherein the first and second electically conductive microstrips interact to facilitate the transfer of energy between the microstrips and the first dielectric element alters frequency characteristics of the transfer of energy. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. An RF electrical coupling device comprising:
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a first substrate having the first electrically conductive microstrip and a first dielectric element disposed thereon; a second substrate adjacent to the first substrate having a second electrically conductive microstrip disposed thereon; and a substrate connection means that serves to structurally connect the first substrate to the second substrate; wherein the first and second electrically conductive microstrips interact to facilitate the transfer of energy between the microstrips and the first dielectric element alters frequency characteristics of the transfer of energy. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. An RF coupling device, comprising:
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a first substrate having a first and second electrically conductive microstrips disposed thereon; a second substrate adjacent to the first substrate having a first dielectric element disposed thereon; and a substrate connection means that serves to structurally connect the first substrate to the second substrate, wherein the first and second electrically conductive microstrips interact to facilitate the transfer of energy between the microstrips and the first dielectric element alters frequency characteristics of the transfer of energy. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37)
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38. An RF electrical coupling device, comprising:
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a first substrate having a first and second electrically conductive microstrips disposed thereon; a second substrate adjacent to the first substrate having a third and fourth electrically conductive microstrips disposed thereon; and a substrate connection means that serves to structurally connect the first substrate to the second substrate, wherein the first, second, third and fourth electrically conductive microstrips interact to facilitate the transfer of energy between the microstrips. - View Dependent Claims (39, 40, 41, 42, 43, 44, 45, 46)
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47. An optical coupling device, comprising:
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a first substrate having one or more optical waveguides formed thereon; a second substrate adjacent to the first substrate having one or more optical waveguides formed thereon; and a substrate connection means that serves to structurally connect the first substrate to the second substrate and to space the first substrate from the second substrate, wherein the one or more optical waveguides formed on the first substrate correspond to at least one optical waveguide formed on the second substrate so as to facilitate optical coupling between the corresponding waveguides. - View Dependent Claims (48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62)
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Specification