Apparatus of antenna with heat slug and its fabricating process

• US 7,042,398 B2
• Filed: 10/05/2004
• Issued: 05/09/2006
• Est. Priority Date: 06/23/2004
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Yeh, Shih-Huang, Tang, Chia-Lun
• Primary Examiner(s): PHAN, THO GIA
• Application Number:
  US10/959,251
• Publication Number:
  US 20050285794A1
• Time in Patent Office: 581 Days
• Field of Search: 343/700.MS, 343/841, 257/659, 257/704
• US Class Current: 343/700.0MS
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48235 connecting the wire to a via metallisation of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/0407 : Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H01Q 9/0421 : with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence

Abstract

An apparatus of antenna with heat slug and its fabricating process are provided, in which the antenna with heat slug can be realized with a single sheet or double sheets of metal. Each single sheet of metal can be achieved by simply cutting and bending a metal plate. Thereby, it is a simple and low-cost fabricating process. In the known fabricating process of integrated circuit, the heat slug and the antenna can be combined in a module at the same step. Therefore, integrating the antenna with heat slug in a fabricating process needs not to develop a new process.

Claims

1. An apparatus of antenna with heat slug, comprising:

a substrate having an upper surface and a lower surface, said lower surface having a plurality of solder balls for electrically connecting to an external circuit;

an antenna signal transmission line formed on said upper surface of said substrate;

at least a chip attached on said upper surface of said substrate and electrically connecting to said antenna signal transmission line;

at least a metal belt formed on said upper surface of said substrate;

at least a metal sheet having functions of an antenna and heat dissipation, placed on said upper surface of said substrate; and

a mold compound encompassing at least said chip, said antenna signal transmission line and each said metal belt.

2. The apparatus as claimed in claim 1, wherein said at least a metal sheet is a single metal sheet, said single metal sheet is made by cutting or molding the metal sheet into a specific shape and then bending said metal sheet, said single metal sheet comprising:

a heat slug having an antenna, placed above said chip and kept a distance from said chip; and

a plurality of support elements, one of said support elements being an antenna feed metal sheet for electrically connecting to said antenna signal transmission line, and the remaining support elements electrically connecting to each said metal belt.

3. The apparatus as claimed in claim 2, wherein the shape of said heat slug having an antenna is either round or rectangular.

4. The apparatus as claimed in claim 2, wherein said heat slug with an antenna and said support elements are perpendicular.

5. The apparatus as claimed in claim 2, wherein said heat slug with an antenna and said substrate are parallel.

6. The apparatus as claimed in claim 1, wherein said at least a metal sheet is a single metal sheet, said single metal sheet is made by cutting or molding the metal sheet into a specific shape and then bending said metal sheet, said single metal sheet comprising:

a heat slug placed above said chip and kept a distance from said chip, said heat slug having a plurality of support elements underneath, said heat slug using said support elements to electrically connect to each said metal belt which connects to a ground plane;

an antenna placed above said heat slug and kept a distance from said heat slug;

at least a connection metal sheet connecting said antenna and said heat slug; and

an antenna feed metal sheet having one end connecting to said antenna and the other end connecting to said antenna signal transmission line.

7. The apparatus as claimed in claim 6, wherein said connection metal sheet and said heat slug, said connection metal sheet and said antenna are both perpendicular.

8. The apparatus as claimed in claim 6, wherein a sealing body encompasses a lower side of said antenna, an upper side of said heat slug, and outer sides of said support elements and said connection metal sheet.

9. The apparatus as claimed in claim 6, wherein said heat slug and said support elements are perpendicular.

10. The apparatus as claimed in claim 6, wherein said heat slug and said antenna are parallel and extend to a same direction.

11. The apparatus as claimed in claim 6, wherein said heat slug and said substrate are parallel.

12. The apparatus as claimed in claim 6, wherein said antenna feed metal sheet and said antenna are perpendicular.

13. The apparatus as claimed in claim 1, wherein said at least a metal sheet further comprises a first metal sheet and a second metal sheet, said first and second metal sheets are made by cutting or molding said metal sheets into a specific shape and then bending said metal sheets respectively, said first metal sheet further comprising:

a heat slug, placed above said chip and kept a distance from said chip; and

a plurality of support elements electrically connecting to each said metal belt which connects to a ground plane;

said second metal sheet further comprising;

an antenna placed above said heat slug and kept a distance from said heat slug; and

an antenna feed metal sheet having one end connecting to said antenna and the other end connecting said antenna signal transmission line;

wherein said mold compound encompasses an upper side of said heat slug and outer sides of said support elements, said antenna is placed above said mold compound and said antenna feed metal sheet feeds said antenna from a side.

14. The apparatus as claimed in claim 13, wherein the shape of said antenna is either round or rectangular.

15. The apparatus as claimed in claim 13, wherein the shape of said antenna feed metal sheet is either triangular or rectangular.

16. The apparatus as claimed in claim 13, wherein said heat slug and said support elements are perpendicular.

17. The apparatus as claimed in claim 13, wherein said heat slug and said antenna are parallel and extend to the same direction.

18. The apparatus as claimed in claim 13, wherein said heat slug and said substrate are parallel.

19. The apparatus as claimed in claim 13, wherein said antenna feed metal sheet and said antenna are perpendicular.

20. A process of fabricating an antenna with heat slug, comprising the following steps of:

(a) providing a substrate, on an upper surface of said substrate, an antenna signal transmission line and a plurality of metal belts being formed, and at least a chip being attached and wire bonded;

(b) placing an antenna and a heat slug on said upper surface of said substrate and applying a mold compound; and

(c) placing a plurality of solder balls on a lower surface of said substrate.

21. The process as claimed in claim 20, wherein said antenna and said heat slug are made of a single metal sheet, said single metal sheet has a plurality of support elements, and said step (b) further comprises the following steps:

cutting or molding said single metal sheet into a specific shape;

bending said single metal sheet;

placing said single metal sheet above said chip, connecting an antenna feed metal sheet to said antenna signal transmission line, and connecting each of said support elements to each of said metal belts; and

applying said mold compound to encompass said chip, said antenna signal transmission line and said metal belts.

22. The process as claimed in claim 21, wherein said heat slug with said antenna is further formed by said single metal sheet, and said antenna feed metal sheet is formed by one of said support elements.

23. The process as claimed in claim 21, wherein said antenna feed metal sheet is further formed by said single metal sheet.

24. The process as claimed in claim 20, wherein said antenna and said heat slug are made of a first metal sheet and a second metal sheet, said first metal sheet has said heat slug and a plurality of support elements, said second metal sheet has said antenna and an antenna feed metal sheet, and said step (b) further comprises the following steps:

cutting or molding said first and second metal sheets into a specific shape, respectively;

bending said first and second metal sheets so that said antenna and said antenna feed metal sheet are perpendicular, and said heat slug and said support elements are perpendicular;

placing said heat slug above said at least a chip, and connecting each of said support elements to each of said metal belts;

applying said mold compound on an upper side of sad heat slug and outer sides of said support elements to encompass said chip, said antenna signal transmission line and said metal belts; and

placing said antenna above said mold compound and connecting said antenna feed metal sheet to said antenna signal transmission line.