Mirror structure with single crystal silicon cross-member

• US 7,042,619 B1
• Filed: 06/18/2004
• Issued: 05/09/2006
• Est. Priority Date: 06/18/2004
• Status: Active Grant

• Current Assignee: Miradia Inc. (Walsin Lihwa Corporation)
• Original Assignee: Miradia Inc. (Walsin Lihwa Corporation)
• Inventors: Woo, Howard, McGinley, Brian K., Mohn, Jonathan D.
• Primary Examiner(s): Dang, Hung Xuan
• Assistant Examiner(s): TRA, TUYEN Q
• Application Number:
  US10/871,150
• Time in Patent Office: 690 Days
• Field of Search: 359/290, 359/291, 359/292, 359/295, 359/298, 359/222, 359/223, 359/224, 359/248
• US Class Current: 359/290
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

Hydrogen cleave silicon process for light modulating mirror structure using single crystal silicon as the base cross-member. Existing processes use two critical alignment steps that can contribute to higher actuation voltages and result in lower manufacturing yields. The hydrogen cleave process simplifies the manufacturing process to one step: transferring a thin film of single crystal silicon to the CMOS substrate, resulting in minimal alignment error and providing large bonding area.

Claims

1. A method of fabricating a micro mirror, comprising:

forming a first substrate defining a cavity on a first side of the first substrate;

implanting hydrogen ions to a predetermined depth on a first side of a second substrate;

bonding the first side of the first substrate to the first side of the second substrate; and

cleaving off a portion of a second side of the second substrate.

2. The method of claim 1, further comprising:

fabricating an electrode and a cross-member on the second substrate.

3. The method of claim 2, further comprising:

forming a mirror on the second substrate.

4. The method of claim 3, wherein the forming a mirror on the second substrate further comprises:

depositing a sacrificial layer onto the second substrate and patterning a via down to the first metal layer;

depositing a second metal layer on the second substrate and in the via;

etching a mirror on the second metal layer; and

removing the sacrificial layer so the mirror plate can rotate about an axis defined by the cross-member.

5. The method of claim 4, further comprising:

prior to depositing a second metal layer on the second substrate and in the via, depositing an adhesive layer in the via.

6. The method of claim 4, wherein the depositing a sacrificial layer further comprises:

filling a gap on and around the cross-member with the sacrificial layer; and

depositing the sacrificial layer on the upper surface of the metallization layer.

7. The method of claim 4, wherein the sacrificial layer is made of photoresist.

8. The method of claim 4, wherein the removing the sacrificial layer is by oxygen ashing.

9. A micro mirror fabricated by the method of claim 4.

10. A micro mirror fabricated by the method of claim 3.

11. The method of claim 2, wherein the fabricating an electrode and a cross-member on the second substrate further comprises:

depositing a first metal layer on the second substrate;

patterning the first metal layer in a pattern that will define the electrodes;

etching the first metal layer and second substrate above the cavity of the first substrate to release the cross-member; and

etching the first metal layer and second substrate to leave behind the material that makes up the electrodes and the cross-member.

12. A micro mirror fabricated by the method of claim 11.

13. The method of claim 1, wherein the second substrate is a single piece of material.

14. The method of claim 13, wherein the single piece of material is single crystal silicon.

15. The method of claim 1, further comprising:

prior to bonding the second substrate on the first side of the first substrate,

fabricating addressing and control circuitry on the first substrate.

16. The method of claim 15, wherein the circuitry is formed using standard CMOS techniques.

17. The method of claim 1, wherein the forming a first substrate defining a cavity further comprises:

putting a mask onto the first substrate, the mask having a first portion defining a location of the cavity, the first portion exposing the first substrate underneath the first portion to be etched, and a second portion defining locations outside of the cavity, the second portion capable of preventing the first substrate underneath the second portion from being etched;

etching the first substrate beneath the first portion of the mask to a predetermined depth; and

removing the mask from the substrate.

18. The method of claim 1, wherein the predetermined depth is 2,000 to 6,000 Angstroms.

19. The method of claim 1, wherein the bonding the first side of the first substrate to the first side of the second substrate occurs at room temperature.

20. The method of claim 1, wherein the cleaving off a portion of the second side of the second substrate occurs by a physical process.

21. The method of claim 1, wherein the cleaving off a portion of the second side of the second substrate occurs by heating under 400 degrees C.

22. A micro mirror fabricated by the method of claim 1.

23. A micro mirror, comprising:

a first layer with a first side and a second side, the first layer having a cavity on the first side;

a second layer with a first side and a second side, the first side of the second layer bonded to the first side of the first layer, wherein the second layer is a single piece of single crystal silicon and the second layer further comprises;

a base fabricated from a portion of the second layer;

a cross-member fabricated from a portion of the second layer substantially aligned with the cavity, the cross-member continuous with and supported by the base, the cross-member suspended over the cavity;

a connector pedestal fabricated on the cross-member, the pedestal substantially in the center of the micro mirror; and

a mirror plate connected to the connector pedestal such that the mirror plate may rotate about an axis defined by the cross-member.

24. The micro mirror of claim 23, wherein the first layer further comprises addressing and control circuitry.

25. The micro mirror of claim 23, wherein the bonding of the first and second layers occurs at room temperature.

26. The micro mirror of claim 23, wherein the second layer is formed by hydrogen-induced silicon layer cleavage.

27. The micro mirror of claim 23, wherein the second layer has a thickness of 2,000 to 6,000 Angstroms.

28. The micro mirror of claim 23, wherein the base forms a bias street of predetermined width around the perimeter of the second layer.

29. The micro mirror of claim 28, wherein the predetermined width is 3 microns or greater.

30. The micro mirror of claim 23, wherein the base acts as a bias plane for the micro mirror.

31. The micro mirror of claim 23, wherein the base has at least one electrode for receiving a voltage to controllably deflect the mirror plate.

32. The micro mirror of claim 23, wherein the cross-member is diagonally oriented with respect to the base.

33. The micro mirror of claim 23, wherein the cross-member is a vertically oriented torsion spring.

34. The micro mirror of claim 23, wherein the cross-member is formed substantially beneath the mirror plate and is substantially concealed by the mirror plate.

35. The micro mirror of claim 23, wherein the pedestal and mirror plate are formed from a single material.

36. The micro mirror of claim 23, where in the single material is aluminum.

37. The micro mirror of claim 23, wherein the mirror plate is substantially square in shape.