Light blocking layers in MEMS packages
First Claim
Patent Images
1. A micromirror array device package, comprising:
- a micromirror array device;
a package substrate having a plurality of interior surfaces together defining a cavity in which the micromirror array device is disposed;
a cover substrate disposed such that the micromirror array device is capable of being enclosed between the package substrate and cover substrate; and
a light blocking material deposited on at least one of the plurality of interior surfaces of the package substrate for reducing scattered light therefrom, wherein the light absorbing material is more absorbing to visible light than said at least one interior surface.
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Abstract
Disclosed herein is a micromirror array device package having a light absorbing material disposed within the package for reducing undesired light scattering. The light absorbing material can be deposited as a thin film (or strip, frame, segments or a combination thereof), or as a vertical wall insert between the micromirror array device and a cover substrate of the package.
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Citations
52 Claims
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1. A micromirror array device package, comprising:
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a micromirror array device; a package substrate having a plurality of interior surfaces together defining a cavity in which the micromirror array device is disposed; a cover substrate disposed such that the micromirror array device is capable of being enclosed between the package substrate and cover substrate; and a light blocking material deposited on at least one of the plurality of interior surfaces of the package substrate for reducing scattered light therefrom, wherein the light absorbing material is more absorbing to visible light than said at least one interior surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
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38. A micromirror army device package, comprising:
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a micromirror array device that is fully encapsulated within a space between a cover substrate and a packaging substrate bonded to the cover substrate, wherein the micromirror array device is attached to one of the two substrates but not the both; and a light absorbing material disposed on an interior surface of the packaging substrate for absorbing light scattered within the space, wherein the light absorbing material is more absorbing than the packaging substrate. - View Dependent Claims (39, 40)
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41. A micromirror array device package, comprising:
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a micromirror array device; a packaging substrate having a plurality of interior surfaces together defining a cavity in which the micromirror device is disposed; a cover substrate bonded to the packaging substrate such that the micromirror array device is encapsulated within the cavity; and a vertical wall within the cavity for absorbing scattered light, wherein the vertical wall is more absorbing than the packaging substrate. - View Dependent Claims (42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52)
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Specification